cULus Recognized
Hyväksyntätunnus: E60425-20110128| Nimellisjännite UN | Nimellisvirta IN | Poikkipinta AWG | Poikkipinta mm2 | |
|---|---|---|---|---|
| B | ||||
| 300 V | 8 A | |||
| D | ||||
| 300 V | 8 A | |||
MCV 1,5/10-G-3,5 GY 5CP
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PCB header
1668850
PCB headers, nominal cross section: 1.5 mm2, color: yellow, nominal current: 8 A, contact surface: Sn, contact connection type: Pin, number of rows: 1, number of positions: 10, product range: MCV 1,5/..-G, pitch: 3.5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard
Tuotetiedot
| Product type | PCB headers |
| Product family | MCV 1,5/..-G |
| Product line | COMBICON Connectors S |
| Number of positions | 10 |
| Pitch | 3.5 mm |
| Number of rows | 1 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | yellow (1018) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Dimensional drawing |
|
| Pitch | 3.5 mm |
| Width [w] | 36.4 mm |
| Height [h] | 12.6 mm |
| Length [l] | 7.25 mm |
| Installed height | 9.2 mm |
| Solder pin length [P] | 3.4 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| PCB design | |
| Hole diameter | 1.2 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Yhteensopivat tuotteet
Edut
Well-known mounting principle allows worldwide use
Vertical connection enables multi-row arrangement on the PCB
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies