ME 45 UTG BU
-
Mounting base housing
2709422
DIN rail housing, Lower housing part with metal foot catch, tall design, without vents, width: 45.2 mm, height: 99 mm, depth: 107.3 mm, color: blue (similar RAL 5015), cross connection: without bus connector, number of positions cross connector: not relevant
Tämä tuote edellyttää muita tuotteita, jotta sitä voidaan käyttää.
Pakolliset lisätarvikkeet
Tuotetiedot
| Assembly note | Please observe the application note in the download area. |
| Product type | Enclosure bottom part |
| Housing type | DIN rail housing |
| Housing series | ME |
| Product family | ME 45.. |
| Type | Lower housing parts without vents, housing cover necessary to complete the module |
| Max. number of positions | 0) |
| Type | Lower housing part with metal foot catch, tall design |
| Ventilation openings present | no |
| Dimensional drawing |
|
| Width | 45.2 mm |
| Height | 99 mm |
| Depth | 107.3 mm |
| Depth from top edge of DIN rail | 100.7 mm |
| Depth from top edge of DIN rail to support point on upper part | 68.5 mm |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
| Color (Housing) | blue (RAL 5015) |
| Flammability rating according to UL 94 | V0 |
| CTI according to IEC 60112 | 600 |
| Housing material | PA |
| Surface characteristics | untreated |
| Power dissipation single housing for 20 °C | |
| Ambient temperature | 20 °C |
| Reduction factor | 1 |
| Mounting position | vertical |
| Power dissipation | 7.6 W |
| Power dissipation single housing for 30 °C | |
| Ambient temperature | 30 °C |
| Reduction factor | 0.91 |
| Mounting position | vertical |
| Power dissipation | 6.9 W |
| Power dissipation single housing for 40 °C | |
| Ambient temperature | 40 °C |
| Reduction factor | 0.81 |
| Mounting position | vertical |
| Power dissipation | 6.1 W |
| Power dissipation single housing for 50 °C | |
| Ambient temperature | 50 °C |
| Reduction factor | 0.7 |
| Mounting position | vertical |
| Power dissipation | 5.3 W |
| Power dissipation single housing for 60 °C | |
| Ambient temperature | 60 °C |
| Reduction factor | 0.57 |
| Mounting position | vertical |
| Power dissipation | 4.3 W |
| Power dissipation single housing for 70 °C | |
| Ambient temperature | 70 °C |
| Reduction factor | 0.49 |
| Mounting position | vertical |
| Power dissipation | 3.7 W |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 125 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60998-1:2002-12 |
| Height of fall | 50 cm |
| Frequency | 10 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Relative humidity (storage/transport) | 80 % |
| Number of PCB holders | 2 |
| Type of PCB mount | Insertion (optional latching by PCB stop) |
| Thickness of the PCB | 1.4 mm ... 1.8 mm |
| Mounting type | DIN rail mounting |
| Type of packaging | packed in cardboard |
| Outer packaging type | Carton |
Edut
Tool-free mounting
Available in overall widths from 12.5 mm ... 90 mm, modular extension is possible
Flammability rating V0 in accordance with UL 94
Variety of connection technology
Can be mounted on the DIN rail
With integrated or DIN-rail-mountable bus connector as an option