UCS 237-195-H-GD 9005 VPE10
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Universal housings
1070370
Complete housing for PCBs, can be positioned flexibly; includes housing half shells, side panels closed, adhesive domes for PCB attachment, screws for housing and PCB attachment; housing: black with turquoise blue corner inlays
Tuotetiedot
| Assembly note | The housing can be opened a maximum of 10 times. |
| Note on application | Attach the adhesive pads: Make sure that the surface of the housing is clean, dry, and free of grease. Temperature range: +18°C ... +30°C / Closing pressure force: 60 N / Closing pressure time: 3 s |
| General | Please observe the application note in the download area. |
| Product type | Complete housing |
| Housing type | Universal housings |
| Housing series | UCS |
| Product family | UCS 237-195 |
| Type | Tall design (GD) |
| Ventilation openings present | no |
| Dimensional drawing |
|
| Width | 237 mm |
| Height | 195 mm |
| Depth | 67 mm |
| Dimensions | 212 mm x 170.2 mm (Maximum circuit board dimensions) |
| PCB design | |
| PCB thickness | 0.8 mm ... 3 mm |
| Color (Housing) | black (RAL 9005) |
| Flammability rating according to UL 94 | V0 |
| CTI according to IEC 60112 | 225 |
| Insulating material | PC |
| Housing material | PC |
| Surface characteristics | untreated |
| Power dissipation single housing for 20 °C | |
| Ambient temperature | 20 °C |
| Reduction factor | 1 |
| Mounting position | vertical |
| Power dissipation | 41.9 W |
| Power dissipation single housing for 30 °C | |
| Ambient temperature | 30 °C |
| Reduction factor | 0.82 |
| Mounting position | vertical |
| Power dissipation | 34.4 W |
| Power dissipation single housing for 40 °C | |
| Ambient temperature | 40 °C |
| Reduction factor | 0.66 |
| Mounting position | vertical |
| Power dissipation | 27.8 W |
| Power dissipation single housing for 50 °C | |
| Ambient temperature | 50 °C |
| Reduction factor | 0.53 |
| Mounting position | vertical |
| Power dissipation | 22.2 W |
| Power dissipation single housing for 60 °C | |
| Ambient temperature | 60 °C |
| Reduction factor | 0.4 |
| Mounting position | vertical |
| Power dissipation | 17.1 W |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 125 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60068-2-31:2008-05 |
| Height of fall | 50 cm |
| Frequency | 50 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Test for substances that would hinder coating with paint or varnish | |
| Specification | VW PV 3.10.7:2005-02 |
| Result | Test passed |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Result, degree of protection, IP code | IP40 |
| Ambient conditions | |
| Max. IP code to attain | IP40 |
| Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Relative humidity (storage/transport) | 80 % |
| Number of PCB holders | 1 |
| Type of PCB mount | Bolt mounting |
| Total PCB surface | 36040 mm² |
| Thickness of the PCB | 0.8 mm ... 3 mm |
| Supported form factors | EPIC, ETX, Nano-ITX, PC/104, Pico-ITX, Raspberry Pi, Mini-DTX, Mini-ITX, EBX |
| Note on PCB holders | This product is prepared for a printed-circuit board. Additional printed-circuit boards can be mounted using adhesive pads (accessories). |
| Mounting type | Screw mounting |
| Mounting position | any |
| Tightening torque / speed | Screw connection between housing halves: 1.2 - 1.4 Nm / 500 - 1000 rpm |
| Mounting the PCB: 0.4 - 0.5 Nm / 500 - 1000 rpm |
| Type of packaging | Box packaging |
Edut
High degree of application flexibility, thanks to the modular housing design
Flexible PCB attachment, adapts to virtually all form factors
Practical customization options
Reduced logistics outlay, thanks to components which are compatible with one another