EH 67,5-C CS/ABS-PC GY7035
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Upper housing part
1069889
DIN rail housing, Upper housing part, tall design, no connection opening, width: 67.6 mm, height: 75.26 mm, depth: 36.95 mm, color: light gray (similar RAL 7035)
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Tuotetiedot
| Assembly note | Please observe the application note in the download area. |
| Product type | Upper housing part |
| Housing type | DIN rail housing |
| Housing series | EH |
| Product family | EH..ABS-PC.. |
| Type | Upper housing part, tall design, no connection opening |
| Ventilation openings present | no |
| Dimensional drawing |
|
| Width | 67.6 mm |
| Height | 75.26 mm |
| Depth | 36.95 mm |
| Depth from base support surface | 19.95 mm |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
| Color (Housing) | light gray (RAL 7035) |
| Flammability rating according to UL 94 | V0 |
| Housing material | ABS-PC |
| Surface characteristics | untreated |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 80 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60998-1:2002-12 |
| Height of fall | 50 cm |
| Frequency | 10 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C ... 80 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 80 °C |
| Relative humidity (storage/transport) | 95 % |
| Type of PCB mount | Latching |
| Thickness of the PCB | 1.4 mm ... 1.8 mm |
| Mounting type | Snap in |
| Type of packaging | packed in cardboard |
| Outer packaging type | Carton |
Edut
DIN rail or panel mounting for application-specific device attachment
Easy design-in, thanks to variable housing form factor
Complete flexibility, thanks to PCBs with horizontal, frontal, and orthogonal orientation to the front of the device
Three cover versions for individual PCB connections
Integration of a wide variety of PCB connection technologies for a functional device design