ME 22,5 F-UTG BUS/ 5 KMGY
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Mounting base housing
2202734
DIN rail housing, Lower housing part with metal foot catch, flat design, without vents, width: 22.6 mm, height: 99 mm, depth: 84.8 mm, cross connection: integrated bus connector, number of positions cross connector: 5, Bus connector: 5 parallel contacts
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Pakolliset lisätarvikkeet
Tuotetiedot
| Assembly note | Please observe the application note in the download area. |
| Recommendation | Material of contact pads for bus connector, galvanic gold (hard gold) |
| Housing type | DIN rail housing |
| Housing series | ME |
| Type | Lower housing part with metal foot catch, flat design |
| Ventilation openings present | no |
| Dimensional drawing |
|
| Width | 22.6 mm |
| Height | 99 mm |
| Depth | 84.8 mm |
| Depth from top edge of DIN rail | 78.2 mm |
| Depth from top edge of DIN rail to support point on upper part | 46 mm |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
| Color | light gray (7035) |
| Flammability rating according to UL 94 | V0 |
| CTI according to IEC 60112 | 600 |
| Housing material | PA |
| Surface characteristics | untreated |
| Power dissipation single housing for 20 °C | |
| Ambient temperature | 20 °C |
| Reduction factor | 1 |
| Mounting position | vertical |
| Power dissipation | 5.5 W |
| Power dissipation single housing for 30 °C | |
| Ambient temperature | 30 °C |
| Reduction factor | 0.91 |
| Mounting position | vertical |
| Power dissipation | 5 W |
| Power dissipation single housing for 40 °C | |
| Ambient temperature | 40 °C |
| Reduction factor | 0.81 |
| Mounting position | vertical |
| Power dissipation | 4.4 W |
| Power dissipation single housing for 50 °C | |
| Ambient temperature | 50 °C |
| Reduction factor | 0.7 |
| Mounting position | vertical |
| Power dissipation | 3.8 W |
| Power dissipation single housing for 60 °C | |
| Ambient temperature | 60 °C |
| Reduction factor | 0.57 |
| Mounting position | vertical |
| Power dissipation | 3.1 W |
| Power dissipation single housing for 70 °C | |
| Ambient temperature | 70 °C |
| Reduction factor | 0.49 |
| Mounting position | vertical |
| Power dissipation | 2.7 W |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 125 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60998-1:2002-12 |
| Height of fall | 50 cm |
| Frequency | 10 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Relative humidity (storage/transport) | 80 % |
| Number of PCB holders | 1 |
| Type of PCB mount | Insertion (optional latching by PCB stop) |
| Thickness of the PCB | 1.4 mm ... 1.8 mm |
| Mounting type | DIN rail mounting |
| Type of packaging | packed in cardboard |
| Outer packaging type | Carton |
Edut
Can be mounted on the DIN rail
With integrated or DIN-rail-mountable bus connector as an option