PCB headers, nominal cross section: 1.5 mm2, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of rows: 1, number of positions: 21, product range: MC 1,5/..-GF, pitch: 3.81 mm, mounting: Wave soldering, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting method: Threaded flange
| Product type | PCB headers |
| Product family | MC 1,5/..-GF |
| Product line | COMBICON Connectors S |
| Number of positions | 21 |
| Pitch | 3.81 mm |
| Number of rows | 1 |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | Wave soldering |
| Flange | |
| Tightening torque | 0.3 Nm |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 µm - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 µm - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 µm - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 µm - 3 µm Ni) |
| Material data - housing | |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Dimensional drawing |
|
| Pitch | 3.5 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.5 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 1.5 mm |
| Ambient conditions | |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Nimellisjännite UN | Nimellisvirta IN | Poikkipinta AWG | Poikkipinta mm2 | |
|---|---|---|---|---|
| B | ||||
| 300 V | 8 A | |||
| D | ||||
| 300 V | 8 A | |||
| Nimellisjännite UN | Nimellisvirta IN | Poikkipinta AWG | Poikkipinta mm2 | |
|---|---|---|---|---|
| B | ||||
| 300 V | 8 A | |||
| D | ||||
| 300 V | 8 A | |||
