CUC-IB2G-J1ST-AT/R4R-PL1
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RJ45 PCB connector
1663996
RJ45 PCB connector, number of positions: 8, 1 Gbps
Detalhes dos produtos
| Product type | Data connector (device side) |
| Type | RJ45 |
| Number of positions | 8 |
| Connection profile | RJ45 |
| Housing shield springs | Yes |
| Number of slots | 1 |
| Type | Socket |
| Shielded | yes |
| Insulation characteristics | |
| Overvoltage category | I |
| Degree of pollution | 2 |
| Rated surge voltage | 1.5 kV |
| Rated surge voltage (III/3) | 1.5 kV |
| Rated current | 0.5 A |
| Insulation resistance | > 500 MΩ |
| Transmission medium | Copper |
| Transmission speed | 1 Gbps |
| Status display | 2 x LED (green, yellow) |
| Status display present | yes |
| Width | 15.75 mm |
| Height | 17.1 mm |
| Length | 21.5 mm |
| Installed height | 14.50 mm |
| Orientation to PCB | 90.00 ° |
| Data pin length | 2.50 mm |
| Material Metal surface contact area (top layer) | Au (0.762 μm/30 μ") |
| Material Metal surface contact area (middle layer) | Ni (1,270 µm min / 50 µ" min) |
| Material Metal surface soldering area (middle layer) | Ni (1,016 µm min / 40 µ" min) |
| Material Metal surface soldering area (top layer) | Sn (3,048 µm min / 120 µ" min) |
| Material | Copper alloy (Housing (shielding)) |
| Ni (0.762 µm min / 30 µ" min) (Housing shielding (top layer)) | |
| Sn (3,048 µm min / 120 µ" min) (Metal surface soldering area shielding (top layer)) | |
| LCP (Housing (female/insert)) | |
| Flammability rating according to UL 94 | V0 |
| Contact material | Phosphor bronze |
| Halogen-free | yes |
| Mechanical data | |
| Insertion/withdrawal cycles | > 750 |
| Insertion force per signal contact | < 20.00 N |
| Extraction force per signal contact | < 20 N |
| Test specification | |
| Specification | IEC 60603-7 |
| Ambient conditions | |
| Degree of protection | IP20 |
| Ambient temperature (operation) | -40 °C ... 85 °C |
| Ambient temperature (storage/transport) | -40 °C ... 85 °C |
| Mounting type | THR solder connection |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Dimensional drawing |
|
| Type of packaging | Tape and Reel |
| [W] tape width | 44 mm |
| [W2] coil overall dimension | 49 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
Vantagens
Simplified Ethernet design process thanks to integrated filtering
Reduced PCB complexity and reduced EMC risks
Automated processing thanks to reflow solderability
Ideal version for any application thanks to wide range of products
Equipped for demanding areas of application thanks to industrial design