cULus Recognized
ID de certificação: E365246-20141111| Tensão nominal UN | Corrente nominal IN | Secção transversal American Wire Gauge | Secção transversal mm2 | |
|---|---|---|---|---|
| 30 A | 14 - 10 |
PTSPL-6/1-2X2 2,9 R32
-
PCB terminal block
1704837
Printed circuit board terminal, nominal current: 41 A, nominal cross section: 6 mm2, number of potentials: 1, number of rows: 1, number of positions per row: 1, product range: PTSPL 6/.., pitch: 0 mm, connection method: Push-in spring connection, mounting: THR soldering / wave soldering, conductor/PCB connection direction: 0 °, color: copper color, Pin layout: Linear pinning, Solder pin [P]: 2.9 mm, number of solder pins per potential: 4, type of packaging: 32 mm wide tape
Detalhes dos produtos
| Product type | Printed circuit board terminal |
| Product family | PTSPL 6/.. |
| Product line | COMBICON Terminals L |
| Type | Circular conductor connection, single-pos. |
| Number of positions | 1 |
| Pitch | 0 mm |
| Number of connections | 1 |
| Number of rows | 1 |
| Number of potentials | 1 |
| Pin layout | Linear pinning |
| Solder pins per potential | 4 |
| Properties | |
| Nominal current IN | 41 A |
| Connection technology | |
| Type | Circular conductor connection, single-pos. |
| Nominal cross section | 6 mm² |
| Conductor connection | |
| Connection method | Push-in spring connection |
| Conductor cross section flexible | 2.5 mm² ... 6 mm² (Conductors with tin-plated litz wires are to be used, for example type PV1-F.) |
| Conductor cross section flexible, with ferrule without plastic sleeve | 2.5 mm² ... 6 mm² |
| Stripping length | 12 mm ... 15 mm |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | hot-dip tin-plated |
| Metal surface terminal point (top layer) | Tin (4 - 8 µm Sn) |
| Metal surface soldering area (top layer) | Tin (4 - 8 µm Sn) |
| Material data - housing | |
| Color (Housing) | copper color () |
| Dimensional drawing |
|
| Pitch | 0 mm |
| Width [w] | 8.7 mm |
| Height [h] | 13.7 mm |
| Length [l] | 14.95 mm |
| Installed height | 10.8 mm |
| Solder pin length [P] | 2.9 mm |
| Pin dimensions | 0.6 x 1 mm |
| PCB design | |
| Hole diameter | 1.3 mm |
| Conductor connection | |
| Specification | IEC 60999-1:1999-11 |
| Result | Test passed |
| Test for conductor damage and slackening | |
| Specification | IEC 60999-1:1999-11 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60999-1:1999-11 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 2.5 mm² / stranded PV1-F / > 50 N |
| 6 mm² / stranded PV1-F / > 80 N | |
| Temperature-rise test | |
| Specification | 60947-7-4/FDIS © IEC 2012 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Temperature cycles | |
| Specification | IEC 60999-1:1999-11 |
| Result | Test passed |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 30g |
| Shock duration | 18 ms |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 32 mm wide tape |
| [W] tape width | 32 mm |
| [W2] coil overall dimension | ≤ 38.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Vantagens
Able to perform without insulating elements: ideal for easy integration into the SMT soldering process
Tool-free spring principle enables time-saving connection of conductors with ferrules and tinned conductors
Defined contact force ensures that contact remains stable over the long term