ME-IO-S BUS8-9005
-
Bus connector
1569885
Plug, color: black, contact surface: Au, number of positions: 8, product range: ME-IO-S.., pitch: 3.15 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 1.5 mm, mounting method: without, type of packaging: 56 mm wide tape
Este produto precisa de outros produtos para a operação.
Acessórios necessários
Detalhes dos produtos
| Assembly note | Please observe the application note in the download area. |
| Product type | Plug |
| Product family | ME-IO-S.. |
| Number of positions | 8 |
| Pitch | 3.15 mm |
| Pin layout | Linear pinning |
| Properties | |
| Contact resistance | 4 mΩ |
| Rated voltage (III/3) | 24 V |
| Rated surge voltage (III/3) | 0.8 kV |
| Rated voltage (III/2) | 24 V |
| Rated surge voltage (III/2) | 0.8 kV |
| Rated voltage (II/2) | 24 V |
| Rated surge voltage (II/2) | 0.5 kV |
| Maximum load current | 4 A |
| Connection method | Direct plug-in technology |
| Pitch | 3.15 mm |
| Width [w] | 15.85 mm |
| Height [h] | 13.55 mm |
| Length [l] | 32 mm |
| Solder pin length [P] | 1.5 mm |
| PCB design | |
| PCB thickness | 1.2 mm |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface terminal point (top layer) | Gold (Au) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 8 |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Comparative tracking index (IEC 60112) | CTI 175 - 249 |
| Rated insulation voltage (III/3) | 24 V |
| Rated surge voltage (III/3) | 0.8 kV |
| minimum clearance value - non-homogenous field (III/3) | 0.8 mm |
| minimum creepage distance (III/3) | 1.25 mm |
| Rated insulation voltage (III/2) | 24 V |
| Rated surge voltage (III/2) | 0.8 kV |
| minimum clearance value - non-homogenous field (III/2) | 0.2 mm |
| minimum creepage distance (III/2) | 0.5 mm |
| Rated insulation voltage (II/2) | 24 V |
| Rated surge voltage (II/2) | 0.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 0.2 mm |
| minimum creepage distance (II/2) | 0.5 mm |
| Mechanical data | |
| Insertion/withdrawal cycles | ≤ 500 |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 25 |
| Insertion strength per pos. approx. | 0.8 N |
| Withdraw strength per pos. approx. | 0.6 N |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N |
Test passed |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 0.91 kV |
| Contact resistance R1 | 4 mΩ |
| Contact resistance R2 | 3.5 mΩ |
| Insertion/withdrawal cycles | 200 |
| Climatic test | |
| Specification | EN ISO 22479:2022-06 |
| Corrosive stress | 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle |
| Thermal stress | 105 °C/168 h |
| Power-frequency withstand voltage | 0.5 kV |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Test directions | X-, Y- and Z-axis |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Thickness of the PCB | 1.2 mm |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Dimensional drawing |
|
| Type of packaging | 56 mm wide tape |
| [W] tape width | 56 mm |
| [W2] coil overall dimension | 62.4 mm |
| [A] coil diameter | 380 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Vantagens
Contact design enables electronics modules to be easily snapped on
Power supply and communication without additional wiring
Direct integration into the module