FP 0,8/ 12-MV-SL 7,15
-
SMD male connectors
1569557
SMD male connector, nominal current: 1.7 A, test voltage: 500 V AC, number of positions: 12, pitch: 0.8 mm, color: black, contact surface: Au, contact connection type: Pin, mounting: SMD soldering
Número de polos
Detalhes dos produtos
| Product type | SMD male connector |
| Product family | FP 0,8/...-MV-SL 7,15 |
| Number of positions | 12 |
| Pitch | 0.8 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
| Properties | |
| Nominal current IN | 1.7 A IEC 60512-5-2:2002-02 (at 20°C 80-pos.) |
| Contact resistance | 25 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003-05 |
| Data transmission | |
| Data transmission rate | 16 Gbps |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Metal surface soldering area (middle layer) | Nickel (Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 150 |
| Flammability rating according to UL 94 | V0 |
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Details for soldering processes | The items are suitable for assembly on both sides and for overhead soldering. |
| Dimensional drawing |
|
| Pitch | 0.8 mm |
| Width [w] | 8.7 mm |
| Height [h] | 12.25 mm |
| Length [l] | 6.1 mm |
| Installed height | 11.65 mm |
| Application | |
| Contact cover | 0.8 mm |
| Center offset | ± 0.7 mm in longitudinal and transverse direction |
| Stack height | 12 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-FV-SL 4,85) |
| 15 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-FV-SL 7,85) | |
| 18 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-FV-SL 10,85) | |
| 18 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-FV-SH 10,85) | |
| Wipe length | 1.5 mm |
| Angular tolerance | ± 5 ° in longitudinal and transverse direction (when plugging in) |
| ± 5 ° in longitudinal and transverse direction (when plugged in) | |
| Axial offset in X direction (longitudinal) | ± 0.3 mm (Tolerance compensation when plugged in) |
| Axial offset in Y direction (transversal) | ± 0.3 mm (Tolerance compensation when plugged in) |
| PCB design | |
| Pad geometry | 0.5 x 1.1 mm |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 80 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Air clearances and creepage distances | | |
| Insulating material group | IIIb |
| Minimum value for clearance and creepage distance | 0.25 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 2000 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.5 mm (10 Hz ... 58 Hz) |
| Acceleration | 200 m/s² (58 Hz ... 2000 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 25 mΩ |
| Contact resistance R2 | 25 mΩ |
| Insertion/withdrawal cycles | 500 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 490 m/s² |
| Shock duration | 11 ms |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Ambient conditions | |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 24 mm wide tape |
| [W] tape width | 24 mm |
| [W2] coil overall dimension | ≤ 30.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Produtos compatíveis
Vantagens
Reliable mechanical and electrical connections, thanks to the double-sided ScaleX contact system
Robustness: ScaleX technology for high tolerance compensation and protection of contacts
Flexible device design: various numbers of positions, designs, and stack heights with high wipe lengths
Perguntas mais frequentes
What is ScaleX?
ScaleX is the registered technology trademark for our patented contact system. The unique double contact ensures a reliable, robust connection of the PCBs, and high tolerance compensation when plugging.... Ver mais
ScaleX is the registered technology trademark for our patented contact system. The unique double contact ensures a reliable, robust connection of the PCBs, and high tolerance compensation when plugging.
Ver menosWhat makes the FP 0,8 series board-to-board connector so special?
The FP 0,8 is our all-rounder for connecting printed circuit boards in the device. The board-to-board connector is a versatile specialist in terms of robustness, flexibility, and variability thanks to our ScaleX contact system. The high data transmis... Ver mais
The FP 0,8 is our all-rounder for connecting printed circuit boards in the device. The board-to-board connector is a versatile specialist in terms of robustness, flexibility, and variability thanks to our ScaleX contact system. The high data transmission of up to 52 Gbps and the current transmission capability of 1.7 A per contact (nominal current) is particularly impressive. Another advantage: The FP 0,8 is available as a shielded and unshielded version, so you can use it in accordance with your individual requirements.
Ver menosWith which numbers of positions is the FP 0,8 board-to-board connector available?
The FP 0,8 is available with the following numbers of positions: 12, 20, 32, 52, and 80, each as a shielded or unshielded version.
Can I also achieve higher nominal currents than 1.7 A per contact?
The upper nominal current limit is 1.7 A per contact for a fully energized connector. For example, if four positions are energized, 3.9 A per contact can be achieved (at an ambient temperature of 20°C).... Ver mais
The upper nominal current limit is 1.7 A per contact for a fully energized connector. For example, if four positions are energized, 3.9 A per contact can be achieved (at an ambient temperature of 20°C).
Ver menosHow can the solder contacts on the shielded FP 0,8-SH series and the unshielded FP 0,8-SL series be tested?
The solder joints of the signal contacts on the FP 0,8-SH and FP 0,8-SL series are located under the plastic housing of the connector. The soldering result can be checked by means of a CT scan or X-ray analysis.
Are the different item versions from the FP 0,8 series compatible with regard to the footprint?
The items from the unshielded FP 0,8-SL series are compatible with the footprint of the shielded FP 0,8-SH items. It is therefore possible to switch flexibly between items from the FP 0,8-SH and FP 0,8-SL series without having to adapt the PCB layout... Ver mais
The items from the unshielded FP 0,8-SL series are compatible with the footprint of the shielded FP 0,8-SH items. It is therefore possible to switch flexibly between items from the FP 0,8-SH and FP 0,8-SL series without having to adapt the PCB layout.
Ver menosWhy are there two unshielded AOI and SL versions in the FP 0,8 series?
The unshielded AOI version offers the advantage of the exposed solder contacts for automatic optical inspection.
The unshielded SL version (shieldless) has the advantage that the solder contacts and therefore the footprint on the PCB are identical...
Ver mais
The unshielded AOI version offers the advantage of the exposed solder contacts for automatic optical inspection.
The unshielded SL version (shieldless) has the advantage that the solder contacts and therefore the footprint on the PCB are identical to the shielded SH version. This means that shielded and unshielded versions can be used without changing the PCB layout. Here, the solder joints can be checked via CT scan or X-ray analysis.