cULus Recognized
ID de certificação: E118976-20230512| Tensão nominal UN | Corrente nominal IN | Secção transversal American Wire Gauge | Secção transversal mm2 | |
|---|---|---|---|---|
| 29.9 V | 0.5 A |
FS 0,635/ 20-FV-R-10,0
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SMD female connectors
1334089
SMD female connector, nominal current: 0.5 A, test voltage: 500 V AC, number of positions: 20, pitch: 0.635 mm, color: black, contact surface: Au, contact connection type: Socket, mounting: SMD soldering
Number of positions
Detalhes dos produtos
| Product type | SMD female connector |
| Product family | FS 0,635/..-FV-R-10,0 |
| Number of positions | 20 |
| Pitch | 0.635 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
| Properties | |
| Nominal current IN | 0.5 A IEC 60512-5-2:2002-02 (40-pos. / 60-pos.) |
| Contact resistance | 70 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003-05 |
| Rated voltage (I/1) | 125 V |
| Rated surge voltage (I/1) | 0.8 kV |
| Data transmission | |
| Data transmission rate | 20 Gbps |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Metal surface soldering area (middle layer) | Nickel (Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 150 |
| Flammability rating according to UL 94 | V0 |
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Dimensional drawing |
|
| Pitch | 0.635 mm |
| Width [w] | 14.22 mm |
| Height [h] | 10.6 mm |
| Length [l] | 6.4 mm |
| Installed height | 10 mm |
| Application | |
| Contact cover | 0.6 mm |
| Center offset | ± 0.5 mm in longitudinal and transverse direction |
| Stack height | 12 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635/..-MV-R- 5,0) |
| 15 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635/..-MV-R- 8,0) | |
| 16 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635/..-MV-R- 9,0) | |
| Wipe length | 0.6 mm |
| Angular tolerance | ± 10 ° in longitudinal and transverse direction (when plugging in) |
| ± 2 ° in longitudinal and transverse direction (when plugged in) | |
| PCB design | |
| Pad geometry | 0.35 x 2.5 mm |
| Hole diameter | 0.9 mm |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 60 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIb |
| Minimum value for clearance and creepage distance | 0.19 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 55 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Acceleration | 181 m/s² |
| Test duration per axis | 2 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 70 mΩ |
| Contact resistance R2 | 70 mΩ |
| Insertion/withdrawal cycles | 50 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Climatic test | |
| Specification | IEC 60068-2-60:2015-06 |
| Corrosive stress | Method 4, 10 days |
| Thermal stress | 125 °C/168 h |
| Power-frequency withstand voltage | 500 V |
| Ambient conditions | |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 32 mm wide tape |
| [W] tape width | 32 mm |
| [W2] coil overall dimension | ≤ 38.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Produtos compatíveis
Vantagens
Design-in support during device development using MCAD/ECAD data and a free sample service
Cost and space savings with the comprehensive portfolio available in various stack heights
Easy mating with integrated keyways and tolerance compensation for error-free production
Time savings during the development process with customer-specific simulations for data integrity
High-speed data transmission up to 30 Gbps for various possible applications
Perguntas mais frequentes
What makes the FS 0,635 board-to-board connector so special?
The extremely space-saving board-to-board connectors allow high-speed data transmission of up to 30 Gbps. Furthermore, additional currents of 0.5 A per contact can be transmitted. Therefore, it can be used flexibly and offers numerous possible applic... Ver mais
The extremely space-saving board-to-board connectors allow high-speed data transmission of up to 30 Gbps. Furthermore, additional currents of 0.5 A per contact can be transmitted. Therefore, it can be used flexibly and offers numerous possible applications with 0.635 mm pitch.
Ver menosHow can the solder contacts on the FS 0,635 board-to-board connector be tested?
The contacts are routed under the housing, enabling automated optical inspection (AOI).
With which numbers of positions is the FS 0,635 board-to-board connector available?
The FS 0,635 board-to-board connector is available with the following numbers of positions: 20, 40, 60, and 80.