CUC-IB7G-J1ST-AT/R4R-P
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Filtered RJ45 PCB connectors
1664008
Filtered RJ45 PCB connectors, design: THD, number of positions: 8 (8P8C), 1 Gbps, degree of protection: IP20, connection method: Female, Tape and Reel
Detalhes dos produtos
| Product type | Data connector (device side) |
| Sensor type | Universal |
| Number of positions | 8 |
| Note number of positions | 8P8C |
| Connection profile | RJ45 |
| Housing shield springs | Yes |
| Number of slots | 1 |
| Shielded | yes |
| Insulation characteristics | |
| Overvoltage category | I |
| Degree of pollution | 2 |
| Rated surge voltage | 1.5 kV DC |
| Rated current | 0.5 A |
| Insulation resistance | > 500 MΩ |
| Transmission speed | 1 Gbps |
| Transmission speed | 1 Gbps |
| Connection technology | |
| Connection method | Female |
| Status display present | no |
| Width | 15.75 mm |
| Height | 17.1 mm |
| Length | 21.5 mm |
| Installed height | 14.50 mm |
| Orientation to PCB | 90.00 ° |
| Data pin length | 2.50 mm |
| Material Metal surface contact area (top layer) | Au (0.762 μm/30 μ") |
| Material Metal surface contact area (middle layer) | Ni (1,270 µm min / 50 µ" min) |
| Material Metal surface soldering area (middle layer) | Ni (1,016 µm min / 40 µ" min) |
| Material Metal surface soldering area (top layer) | Sn (3,048 µm min / 120 µ" min) |
| Material | Copper alloy (Housing (shielding)) |
| Ni (0.762 µm min / 30 µ" min) (Housing shielding (top layer)) | |
| Material Contact | Phosphor bronze |
| Material | LCP (Housing (female/insert)) |
| Test voltage Core/Shield | 1.50 kV DC |
| Halogen-free | yes |
| Flame resistance | UL 94 V0 |
| Mechanical data | |
| Insertion/withdrawal cycles | > 750 |
| Insertion force | < 20 N |
| Withdrawal force | < 20 N |
| Test specification | |
| Specification | IEC 60603-7 |
| Ambient conditions | |
| Degree of protection (when plugged in) | IP20 |
| Degree of protection | IP20 |
| Ambient temperature (operation) | -40 °C ... 85 °C |
| Ambient temperature (storage/transport) | -40 °C ... 85 °C |
| Flame resistance | UL 94 V0 |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Dimensional drawing |
|
| Type of packaging | Tape and Reel |
| [W] tape width | 44 mm |
| [W2] coil overall dimension | 49 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
Produtos compatíveis
Vantagens
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Reduced PCB complexity and reduced EMC risks
Automated processing thanks to reflow solderability