UCS 145-125-F-CCD 7035
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Universal housings
2203447
Complete housing for PCBs, fixed to the corner inlays, includes housing half shells, side panels closed, corner inlays with PCB attachment, screws for housing and PCB attachment, light gray housing with turquoise blue corner inlays
Detalhes dos produtos
| Assembly note | The housing can be opened a maximum of 10 times. |
| Note on application | Attach the adhesive pads: Make sure that the surface of the housing is clean, dry, and free of grease. Temperature range: +18°C ... +30°C / Closing pressure force: 60 N / Closing pressure time: 3 s |
| General | Please observe the application note in the download area. |
| Product type | Complete housing |
| Housing type | Universal housings |
| Housing series | UCS |
| Product family | UCS 145-125 |
| Type | Flat design (CCD) |
| Ventilation openings present | no |
| Dimensional drawing |
|
| Width | 145 mm |
| Height | 125 mm |
| Depth | 47 mm |
| Dimensions | 120 mm x 100 mm (Maximum circuit board dimensions) |
| PCB design | |
| PCB thickness | 0.8 mm ... 3 mm |
| Color (Housing) | light gray (RAL 7035) |
| Color (Corner inlay) | turquoise green (RAL 5018) |
| Material (Housing) | PC |
| Material (Corner inlay) | PA |
| Flammability rating according to UL 94 | V0 |
| CTI according to IEC 60112 | 225 |
| Surface characteristics | untreated |
| Power dissipation single housing for 20 °C | |
| Ambient temperature | 20 °C |
| Reduction factor | 1 |
| Mounting position | vertical |
| Power dissipation | 11 W |
| Power dissipation single housing for 30 °C | |
| Ambient temperature | 30 °C |
| Reduction factor | 0.85 |
| Mounting position | vertical |
| Power dissipation | 9.4 W |
| Power dissipation single housing for 40 °C | |
| Ambient temperature | 40 °C |
| Reduction factor | 0.7 |
| Mounting position | vertical |
| Power dissipation | 7.7 W |
| Power dissipation single housing for 50 °C | |
| Ambient temperature | 50 °C |
| Reduction factor | 0.55 |
| Mounting position | vertical |
| Power dissipation | 6 W |
| Power dissipation single housing for 60 °C | |
| Ambient temperature | 60 °C |
| Reduction factor | 0.4 |
| Mounting position | vertical |
| Power dissipation | 4.4 W |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 125 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60068-2-31:2008-05 |
| Height of fall | 50 cm |
| Frequency | 50 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Test for substances that would hinder coating with paint or varnish | |
| Specification | VW PV 3.10.7:2005-02 |
| Result | Test passed |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Result, degree of protection, IP code | IP40 |
| Ambient conditions | |
| Max. IP code to attain | IP40 |
| Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Relative humidity (storage/transport) | 80 % |
| Number of PCB holders | 1 |
| Type of PCB mount | Bolt mounting |
| Total PCB surface | 12000 mm² |
| Thickness of the PCB | 0.8 mm ... 3 mm |
| Note on PCB holders | This product is prepared for a printed-circuit board. Additional printed-circuit boards can be mounted using adhesive pads (accessories). |
| Mounting type | Screw mounting |
| Mounting position | any |
| Tightening torque / speed | Screw connection between housing halves: 1.2 - 1.4 Nm / 500 - 1000 rpm |
| Mounting of PCB on corner feeder: 0.4 - 0.5 Nm / 500 - 1000 rpm |
| Type of packaging | Box packaging |
Vantagens
High degree of application flexibility, thanks to the modular housing design
Flexible PCB attachment, adapts to virtually all form factors
Practical customization options
Reduced logistics outlay, thanks to components which are compatible with one another
Perguntas mais frequentes
What support does Phoenix Contact provide in the area of thermal management?
Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.... Ver mais
Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.
Ver menosFor which housing families are heatsinks available?
How is heat transferred between the hotspot and the heatsink?
The component that heats strongly (the hotspot) is connected to the heatsink by a thermally conductive material (TIM). In the case of the UCS housing system, optionally inserted heat spreaders can also bridge larger distances between the component to... Ver mais
The component that heats strongly (the hotspot) is connected to the heatsink by a thermally conductive material (TIM). In the case of the UCS housing system, optionally inserted heat spreaders can also bridge larger distances between the component to be cooled and the heatsink.
Ver menosHow are components of different heights and sizes ideally connected to the heatsink?
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.... Ver mais
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.
Ver menosWhat influence does heating have on the reliability of a device?
The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.... Ver mais
The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.
Ver menosWhich factors influence the temperature in the housing?
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.... Ver mais
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.
Ver menosWhat information do the power dissipation diagrams provide?
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of ... Ver mais
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.
Ver menosHow do heatsinks help dissipate developing heat?
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to t... Ver mais
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to the environment. The stack effect is utilized, during which the heated air rises and is displaced by cold air.
Ver menosWhat other options are there for thermal optimization?
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.... Ver mais
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.
Ver menos