cULus Recognized
ID de certificação: E60425-20110128| Tensão nominal UN | Corrente nominal IN | Secção transversal American Wire Gauge | Secção transversal mm2 | |
|---|---|---|---|---|
| Use group B | ||||
| 150 V | 8 A | |||
| Use group D | ||||
| 150 V | 8 A | |||
MCDN 1,5/ 7-G1-3,81 P14THR
-
PCB header
1749382
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 14, number of rows: 2, number of positions: 7, number of connections: 14, product range: MCDN 1,5/..-G1-THR, pitch: 3.81 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 1,5 - MCDN 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard, The pin length is 1.4 mm. User information and design recommendations on Through Hole Reflow Technology can be found at: Downloads".
Detalhes dos produtos
| Product type | PCB headers |
| Product family | MCDN 1,5/..-G1-THR |
| Product line | COMBICON Connectors S |
| Type | Component suitable for through hole reflow |
| Number of positions | 7 |
| Pitch | 3.81 mm |
| Number of connections | 14 |
| Number of rows | 2 |
| Number of potentials | 14 |
| Mounting flange | without |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Contact resistance | 2 mΩ |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Dimensional drawing |
|
| Pitch | 3.81 mm |
| Width [w] | 27.76 mm |
| Height [h] | 16.6 mm |
| Length [l] | 13.3 mm |
| Installed height | 15.2 mm |
| Solder pin length [P] | 1.4 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| PCB design | |
| Pin spacing | 3.50 mm |
| Hole diameter | 1.4 mm |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N |
Test passed |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 25 |
| Insertion strength per pos. approx. | 8 N |
| Withdraw strength per pos. approx. | 6 N |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 20 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2.5 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 2.95 kV |
| Contact resistance R1 | 2 mΩ |
| Contact resistance R2 | 2 mΩ |
| Insertion/withdrawal cycles | 25 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Climatic test | |
| Specification | ISO 6988:1985-02 |
| Corrosive stress | 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle |
| Thermal stress | 100 °C/168 h |
| Power-frequency withstand voltage | 1.39 kV |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Vantagens
Designed for integration into the SMT soldering process
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density