cULus Recognized
ID de certificação: E60425-20181123| Tensão nominal UN | Corrente nominal IN | Secção transversal American Wire Gauge | Secção transversal mm2 | |
|---|---|---|---|---|
| Use group B | ||||
| 300 V | 16 A | |||
ICC20-H/3L5,0-BK GP
-
PCB header
1540629
PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 16 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: ICC..-H/..L5,0, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: ICC 2,5, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting method: without, type of packaging: Box packaging, Product with pin output on left side
Este produto precisa de outros produtos para a operação.
Acessórios necessários
Detalhes dos produtos
| Product type | PCB headers |
| Product family | ICC..-H/..L5,0 |
| Type | Header perpendicular to the PCB |
| Number of positions | 3 |
| Pitch | 5 mm |
| Number of connections | 3 |
| Number of rows | 1 |
| Number of potentials | 3 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 16 A |
| Nominal voltage UN | 320 V |
| Rated voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| Rated voltage (II/2) | 630 V |
| Rated surge voltage (II/2) | 4 kV |
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface terminal point (top layer) | Tin (2 - 4 µm Sn) |
| Metal surface terminal point (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface contact area (top layer) | Tin (2 - 4 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (2 - 4 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Additional text | bio-based |
| Insulating material | PA (bio-based) |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Assembly note | Please observe the application note in the download area. |
| General | Further information and detailed dimensions are available in the download area. |
| Dimensional drawing |
|
| Pitch | 5 mm |
| Width [w] | 20 mm |
| Height [h] | 22.4 mm |
| Length [l] | 20.12 mm |
| Solder pin length [P] | 3.5 mm |
| Pin dimensions | 1 x 1 mm |
| PCB design | |
| Hole diameter | 1.4 mm |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N |
Test passed |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 25 |
| Insertion strength per pos. approx. | 13 N |
| Withdraw strength per pos. approx. | 8 N |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 4 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 30 GΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value - non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 3.2 mm |
| Rated insulation voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value - non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 630 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value - non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 3.2 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Insulation resistance, neighboring positions | > 30 GΩ |
| Climatic test | |
| Specification | ISO 6988:1985-02 |
| Corrosive stress | 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle |
| Thermal stress | 105 °C/168 h |
| Power-frequency withstand voltage | 2.21 kV |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 105 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | Box packaging |
Vantagens
Reduction of the carbon footprint through the use of bio-based plastics
Variable coding, for reliable protection against incorrect connection
Designed for integration into the wave soldering process
Easy and fast push-in mounting of assembled printed-circuit boards, thanks to stable guide rails
Quick and easily coded when initially connecting the connector and header