DMCV 0,5/11-G1-2,54 SMD R56
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PCB header
1845263
PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 22, number of rows: 2, number of positions: 11, number of connections: 22, product range: DMCV 0,5/..-G1-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: 56 mm wide tape
Product details
| Product type | PCB headers |
| Product family | DMCV 0,5/..-G1-SMD |
| Product line | COMBICON Connectors XS |
| Number of positions | 11 |
| Pitch | 2.54 mm |
| Number of connections | 22 |
| Number of rows | 2 |
| Number of potentials | 22 |
| Mounting type | without |
| Pin layout | Linear pad geometry |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Contact resistance | 2.5 mΩ |
| Rated voltage (III/3) | 32 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 160 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface contact area (top layer) | Gold (0.25 Au) |
| Metal surface contact area (middle layer) | Nickel (2 - 4 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.25 Au) |
| Metal surface soldering area (middle layer) | Nickel (2 - 4 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Dimensional drawing |
|
| Pitch | 2.54 mm |
| Width [w] | 32.52 mm |
| Height [h] | 7.1 mm |
| Length [l] | 7.39 mm |
| Pin dimensions | 0.64 x 0.64 mm |
| PCB design | |
| Pad geometry | 1.2 x 2.85 mm |
| 1.2 x 2.85 mm | |
| Pin spacing | 2.54 mm |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N |
Test passed |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 100 |
| Insertion strength per pos. approx. | 2 N |
| Withdraw strength per pos. approx. | 1 N |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 16 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 32 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 1.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 160 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 1.6 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 500 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 500 Hz) |
| Test duration per axis | 2 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 2.95 kV |
| Contact resistance R1 | 2.5 mΩ |
| Contact resistance R2 | 2.7 mΩ |
| Insertion/withdrawal cycles | 100 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Climatic test | |
| Specification | DIN 50018:2013-05 |
| Corrosive stress | 1.0 dm3 SO2 on 300 dm3/40 °C/3 cycles |
| Thermal stress | 105 °C/168 h |
| Power-frequency withstand voltage | 1.39 kV |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 105 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 56 mm wide tape |
| [W] tape width | 56 mm |
| [W2] coil overall dimension | ≤ 62.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
Your advantages
Gold-plated contacts ensure transfer quality remains stable over the long term
Designed for integration into the SMT process
Vertical connection enables multi-row arrangement on the PCB
Small component size for applications where space is at a premium