Main features
- Pitches from 2.5 mm to 3.5 mm
- Connection technologies with screw, Push-in spring, and crimp connection
- Assembly of headers via wave or THR soldering
- Horizontal, vertical, and inverted versions of the connectors and headers
- Connectors for wire-to-board, board-to-board, and wire-to-wire
- Shielded versions for optimum data transmission