ME-IO multifunctional housings

ME-IO multifunctional electronics housings with modular front connection technology

The electronics housings from the ME-IO series are particularly suitable for applications with a limited amount of installation space and high function requirements. Tailor-made modules, such as controllers and I/O modules, can be easily assembled thanks to their modular design. The Push-in connection technology and compact design enable the implementation of individual devices with up to 54 positions per overall width of 18.8 mm.

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Go to Product Detail Page for item 2202396
TBUS8-18,8-PPPPPPPP-7035 - DIN rail bus connectors
TBUS8-18,8-PPPPPPPP-7035 - DIN rail bus connectors
2202396

DIN rail connector, color: light grey, nominal current: 6 A (parallel contacts), rated voltage (III/2): 32 V, number of positions: 8, product range: TBUS8-18,8.., pitch: 2.54 mm, mounting: DIN rail mounting, locking: without, mounting: without, type of packaging: packed in cardboard, Item with gold-plated contacts, bus connectors for connecting with electronics housings, 8 parallel contacts

Go to Product Detail Page for item 2201780
HSCP-SP 2,5-1U4-7035 - PCB connectors
HSCP-SP 2,5-1U4-7035 - PCB connectors
2201780

PCB connector, nominal cross section: 2.5 mm2, color: light grey, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Socket, number of potentials: 4, number of rows: 2, number of positions: 4, number of connections: 4, product range: HSCP-SP 2,5-.., pitch: 5 mm, connection method: Push-in spring connection, conductor/PCB connection direction: 0 °, locking clip: - Locking clip, plug-in system: HSC 2,5, locking: without, mounting: without, type of packaging: packed in cardboard, Color of the spring lever: orange

Go to Product Detail Page for item 2201788
HSCH 2,5-3U/12 9005 - PCB header
HSCH 2,5-3U/12 9005 - PCB header
2201788

PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Pin, number of potentials: 12, number of rows: 2, number of positions: 12, number of connections: 12, product range: HSCH 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: HSC 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

Go to Product Detail Page for item 2201789
HSCH 2,5-2U/ 8 9005 - PCB header
HSCH 2,5-2U/ 8 9005 - PCB header
2201789

PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Pin, number of potentials: 8, number of rows: 2, number of positions: 8, number of connections: 8, product range: HSCH 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: HSC 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

Your advantages

  • Three overall module widths (18.8 mm, 37.6 mm, 75.2 mm) for a wide range of applications
  • Convenient front connections for transmitting signals, data, and power
  • High connection density: 4- and 6-pos. connectors with 3.45 mm and 5.0 mm pitch
  • Blockbelts enable connector types to be grouped mechanically in any way in a confined space
  • Additional marking option through the use of inserts in the transparent marking lid
  • Bridged connectors as a TWIN connection replace TWIN ferrules
Free sample
Test the ME-IO series multifunctional housings
Would you like to test ME-IO series electronics housings with modular front connection technology? – Order your personal sample set right now. We provide expert advice on the selection and design-in of the housings in the desired application. Discover the advantages of Phoenix Contact solutions for yourself.
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ME-IO series electronics housings
Field housings and DIN rail housings

Configurator for electronics housings

Create your electronics housing for the field or indoor application: Select the desired housing series, the corresponding lower part, and the cover. Add the appropriate connection technology and the process is complete.

New products

Connector for 8-position DIN rail connectors
Bridge for DIN rail connectors

Connector for 8-position DIN rail connectors

Module communication over several levels

Some applications also require data and signals from the module communication beyond the module network, for example, in the case of a line feed. Here, input and output connectors for the 8-position DIN rail connector connect modules over several levels. They can be used on the left, right, and center.

Main features

  • 8-position module communication
  • Available as input and output
  • End bracket function

Your Advantages

  • Input and output of the 8-position bus connection in the module network with ME-IO and ICS housings
  • Optimum use of space with ordered cable routing
  • Easy marking with a large printing area

Bridge for DIN rail connectors

Making optimum use of installation space

The transmission of data and signals for applications without a necessary output to the PCB can be looped through by a bridge for DIN rail connectors below the module. This enables you to maximize the use of the PCB surface.

Main features

  • 8-position module communication
  • Available in the widths 18.8, 20, and 25 mm

Your Advantages

  • Can be integrated into device applications based on ME-IO and ICS housings
  • Increased maximum PCB surface
  • Connection of the positions in the field with FMC connectors

ME-IO series housings for I/O modules at a glance One housing, various connection options: This is the principle behind the ME-IO housing system. Click on one of the spots for more information

Module on a DIN rail with multifunctional ME-IO series housings
TBUS8 DIN rail connectors
8-position DIN rail connectors with parallel and serial contacts for easy module-to-module communication.
TBUS8 DIN rail connectors
Optical signal displays
Light guides in various designs for status and diagnostic indicators.
Optical signal displays
Modular connection technology
Color-coded front connections for greater ease of wiring.
Modular connection technology
Different module widths and depths
Four module widths as well as housing versions for different PCB surfaces.
Different module widths and depths
Versatile display modules
Cover versions for integrating displays or touch displays that can be fully integrated.
Versatile display modules
System components that can be integrated
The ME-IO housing features connectors that can be integrated, such as RJ45 and board-to-board connectors.
System components that can be integrated
Tailored cover adaptation
Customizable connection technology for devices that satisfy the latest market requirements.
Tailored cover adaptation
ME-IO housing system
ME-IO housing system YouTube

ME-IO housing system

Tailor-made housing solution for modular control systems

Front connection technology for I/O modules

Module made up of ME-IO housings
Assembled front connection technology (Blockbelts) for the ME-IO housing
Lock-and-release system on an ME-IO housing
Connection technology for the ME-IO housing with different codings
TBUS 8 for use in the ME-IO housing system
Module made up of ME-IO housings

Up to four module widths of 18.8 mm, 37.6 mm, 56.4 mm, and 75.2 mm enable device manufacturers to realize a wide range of applications. In addition, there are housing versions with a module depth for a PCB area up to a maximum of 6,580 mm² and up to 8,510 mm² per 18.8 mm module width. Printed circuit boards can be connected vertically and horizontally to the DIN rail.

Assembled front connection technology (Blockbelts) for the ME-IO housing

With push-in front connection technology and a compact design, you can implement devices with up to 54 positions per 18.8 mm overall width. This high connection density is made possible by 4 and 6-position connectors with pitches of 3.45 mm and 5.0 mm. You can tailor the connection technology to your own design. USB, mini-USB, RJ45, D-SUB, and SD cards are available for this purpose. You can use Blockbelts to realize any mechanical combination of connector types.

Lock-and-release system on an ME-IO housing

Lock and release connectors quickly and easily with the lock-and-release system. This allows you to replace modules without time-consuming connection work – no special tools are required.

Connection technology for the ME-IO housing with different codings

Versatile coding elements in the connector and header provide device manufacturers with increased mating reliability in connection technology.

TBUS 8 for use in the ME-IO housing system

The 8-position TBUS 8 DIN rail connector provides up to four parallel and serial contacts for easy module-to-module communication. In addition, the TBUS 8 allows you to use the ICS series housings with ME-IO series housings in one application.

Video: ME-IO series electronics housings
ME-IO series electronics housings YouTube

Easy assembly of the ME-IO series electronics housing

The ME-IO is the housing system with the high-position front connection technology. This allows you to assemble multifunctional applications step-by-step.

Development kits for prototypes and pre-series devices

Develop quickly and cost-effectively with development kits

Our development kits provide a quick way for you to develop your prototypes and pre-series devices. The kits contain complete housing solutions with integrated connection technology and corresponding perfboard PCBs. You can implement entire device systems with specific bus connectors. Configure your development kit in our e-shop and start right away on your device development project.

The ME-IO and ICS series housings in one module on a DIN rail

Can be combined with modular ICS series housings

The ME-IO and ICS series housings in one module on a DIN rail
Using the TBUS 8 DIN rail connectors, device manufacturers can combine the strengths of the ME-IO and ICS housing series in one application.

E-paper
Overview of the electronics housings portfolio
Discover housings for the DIN rail and outdoor use and learn how flexibly you can adapt electronics housings to your individual needs.
Open the e-paper
DIN rail housings and field housings
Electronics housings of the ME MAX series

Technical principles of electronics housings Solutions for DIN rail applications

Electronics housings are an elementary part of a device. They determine its appearance and protect the electronics from external influences. In addition, they enable assembly in superordinate units. Device manufacturers must therefore pay attention to many details, and not only in the design, but also in the choice of housing when it comes to materials and quality testing. This brochure provides you with all the details.