The solutions made possible by the ICS modular housing system are as varied as the requirements for future-oriented automation devices. Benefit from a housing system with graduated sizes, variable connection technology, and optional DIN rail connectors.
DIN rail housing, ICS filler, with vents, width: 20 mm, height: 7.25 mm, depth: 89.8 mm, color: blue (similar RAL 5015)
DIN rail housing, ICS filler, with antenna function cutout, width: 20 mm, height: 7.25 mm, depth: 22.4 mm, color: blue (similar RAL 5015)
DIN rail housing, ICS filler, with antenna function cutout, width: 20 mm, height: 7.25 mm, depth: 22.4 mm, color: yellow (similar RAL 1018)
DIN rail housing, ICS filler, with USB function cutout, width: 20 mm, height: 7.25 mm, depth: 22.4 mm, color: yellow (similar RAL 1018)
Configure your ICS housing. Choose from Push-in and screw connection technologies. Antenna, USB, or RJ45 connections can be easily integrated with additional accessories. Prepared displays, keypads, and heatsinks enable you to create sophisticated applications. You can also use the PROTIQ 3D printing service for prototype production of your housing cover. Once the configuration has been completed, you can use the online thermal simulation and get your design into series production.
Benefit from a comprehensive selection of modules and a high degree of flexibility in connection technology for IoT applications: Standardized connection technology such as RJ45, USB, and D-SUB connections can be used in a modular way for ICS series DIN rail housings. The 8-pos. TBUS also makes module-to-module communication easier.
Connect individual ICS housings together easily. 8-position TBUS 8 DIN rail connectors with serial and parallel contacts enable easy module-to-module communication in the control cabinet.
The ICS series for the DIN rail features modular connection technology for RJ45, D-SUB, USB, and antenna connections that is unique on the market. PCB headers enable plug-in connection technology of the ICS housing series. Connectors with screw or Push-in technology, with 3 and 4 positions with 5.0 mm pitch increase their flexibility.
The modular system of the ICS housing provides a high level of scalability, tailor-made for your requirements. Overall widths of 20 mm, 25 mm, and 50 mm, installed heights of 77.5 mm, 100 mm, and 122.5 mm, and installed depths of 87.5 mm, 110 mm, and 132.5 mm are available.
Because of its flexibility, the ICS housing enables technically complex solutions to be implemented in a confined space in the control cabinet. Make ideal use of the space for up to two PCBs with a width of 25 mm and for up to four PCBs with a width 50 mm – with an installation time of just a few seconds. This gives you more space and area for relays and electrolytic capacitors. The design, colors, and printing can be tailored.
The visualization and adjustment of processes and characteristic values at the touch of a finger are becoming increasingly important. Touch displays and high-resolution displays with membrane keypads enrich the equipment of the ICS series modular system.
Light guides are available in various designs for status and diagnostic indicators. Mounting is simple thanks to press pins. On request, the fiber-optic cables can be supplied matched to your DIN rail housing.
The range of accessories for the ICS housing series now includes a user-friendly mounting device. The mounting device can be used with ICS housings of various sizes.
Passive heatsinks allow the devices to be used even in thermally demanding applications. Extensive thermal simulations help achieve the optimum arrangement of components on the printed circuit board.
Heatsinks are currently available for the ICS (Industrial Case System, for the DIN rail) and UCS (Universal Case System, for outdoor use) housing series.
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.
The maximum temperature has a particularly high impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 mm x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.
Use the strengths of two housing families for your application: The two product families ME-IO and ICS can be combined flexibly with each other via T-BUS DIN rail connectors – in whichever way your application requires.
Electronics housings are an elementary part of a device. They determine its appearance and protect the electronics from external influences. In addition, they enable assembly in superordinate units. Device manufacturers must therefore pay attention to many details, and not only in the design, but also in the choice of housing when it comes to materials and quality testing. This brochure provides you with all the details.
