cULus Recognized
Approval ID: E60425-20110128| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| B | ||||
| 300 V | 8 A | |||
| D | ||||
| 300 V | 8 A | |||
SMC 1,5/ 7-G-3,81 HT BK AU CP4
-
PCB header
1999466
PCB headers, nominal cross section: 1.5 mm2, color: black, contact surface: Au, contact connection type: Pin, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: SMC 1,5/..-G-HT, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard
Product details
| Product type | PCB headers |
| Product family | SMC 1,5/..-G-HT |
| Product line | COMBICON Connectors S |
| Number of positions | 7 |
| Pitch | 3.81 mm |
| Number of connections | 7 |
| Number of rows | 1 |
| Number of potentials | 7 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Mounting type | THR soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (2 - 4 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface soldering area (middle layer) | Nickel (2 - 4 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | PA |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 325 |
| Flammability rating according to UL 94 | V0 |
| Dimensional drawing |
|
| Pitch | 3.81 mm |
| Width [w] | 28.06 mm |
| Height [h] | 14.4 mm |
| Length [l] | 13.1 mm |
| Installed height | 11 mm |
| Solder pin length [P] | 3.4 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| PCB design | |
| Hole diameter | 1.2 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
| Outer packaging type | Dry bag |
Compatible products
Your advantages
Gold-plated contacts ensure transfer quality remains stable over the long term
Designed for integration into the SMT soldering process
Angled connection enables multi-row arrangement on the PCB
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies