cULus Recognized
Approval ID: E60425-20110128| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| Use group B | ||||
| 150 V | 8 A | |||
| Use group D | ||||
| 150 V | 8 A | |||
MCDN 1,5/12-G1-3,5 RNP26THR AU
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PCB header
1710779
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 24, number of rows: 2, number of positions: 12, number of connections: 24, product range: MCDN 1,5/..-G1-RN-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 1,5 - MCDN 1,5, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting method: Engagement nose, type of packaging: packed in cardboard, Article with engagement nose. The pin length is 14 mm. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"
Product details
| Product type | PCB headers |
| Product family | MCDN 1,5/..-G1-RN-THR |
| Product line | COMBICON Connectors S |
| Number of positions | 12 |
| Pitch | 3.5 mm |
| Number of connections | 24 |
| Number of rows | 2 |
| Number of potentials | 24 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (1 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface soldering area (middle layer) | Nickel (1 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Dimensional drawing |
|
| Pitch | 3.5 mm |
| Width [w] | 45.7 mm |
| Height [h] | 16.6 mm |
| Length [l] | 13.3 mm |
| Installed height | 15.2 mm |
| Solder pin length [P] | 1.4 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| PCB design | |
| Pin spacing | 3.50 mm |
| Hole diameter | 1.4 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2.5 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Compatible products
Your advantages
Gold-plated contacts ensure transfer quality remains stable over the long term
Designed for integration into the SMT soldering process
Intuitive locking mechanism prevents accidental disconnection
Conductor connection on several levels enables higher contact density