EH 90 F-B/ABS BK9005
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Mounting base housing
2200664
DIN rail housing, Lower housing part with base latch, flat design, without vents, width: 90.1 mm, height: 75 mm, depth: 30.3 mm, color: black (similar RAL 9005), cross connection: without bus connector, number of positions cross connector: not relevant
Product details
| Assembly note | Please observe the application note in the download area. |
| Product type | Lower housing part |
| Housing type | DIN rail housing |
| Housing series | EH |
| Product family | EH..F..ABS.. |
| Type | Lower housing parts without vents, housing cover necessary to complete the module |
| Max. number of positions | 0) |
| Ventilation openings present | no |
| Dimensional drawing |
|
| Width | 90.1 mm |
| Height | 75 mm |
| Depth | 30.3 mm |
| Depth from top edge of DIN rail to support point on upper part | 26 mm |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
| Color (Housing) | black (RAL 9005) |
| Material | ABS |
| Flammability rating according to UL 94 | HB |
| Surface characteristics | untreated |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 80 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60998-1:2002-12 |
| Height of fall | 50 cm |
| Frequency | 10 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C ... 80 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 80 °C |
| Relative humidity (storage/transport) | 95 % |
| Type of PCB mount | Latching |
| Thickness of the PCB | 1.4 mm ... 1.8 mm |
| Mounting type | DIN rail mounting/panel mounting (with optional base latch) |
| Type of packaging | packed in cardboard |
| Outer packaging type | Carton |
Compatible products
Your advantages
DIN rail or panel mounting for application-specific device attachment
Easy design-in, thanks to variable housing form factor
Complete flexibility, thanks to PCBs with horizontal, frontal, and orthogonal orientation to the front of the device
Three cover versions for individual PCB connections
Integration of a wide variety of PCB connection technologies for a functional device design