Electronics housings with corresponding heatsinks and optimized PCB layouts offer optimal cooling and increased device performance. For BC, ME-IO, ICS, and UCS series electronics housings, Phoenix Contact therefore offers a combination of suitable heatsinks and a unique simulation service that maximizes the thermal efficiency of the device.

With a width of 50 mm, the new lower housing part for the ICS series from Phoenix Contact provides the largest possible PCB surface and thus creates more space for the electronics it holds.

The evaluation (EVA) board holder for UM-BASIC and UM-PRO extruded profile housings from Phoenix Contact is a flexibly adjustable holder system for accommodating PCBs of various sizes. The system can be mounted on a UM-BASIC/-PRO 122 profile from Phoenix Contact.

The ME-IO Slim is the efficient housing solution from Phoenix Contact for compact controllers that require high-density front connection technology. The module width of just 12 mm enables space-saving system designs.

Phoenix Contact presents the GameChangers for device connectivity: With progressive ideas, technologies, and materials, they offer solutions for improving speed, compactness, weight, robustness, flexibility, and performance in device manufacturing.

Phoenix Contact will be presenting its product highlights and solutions on the subject of signal, data, and power transmission at electronica 2024 in Munich, Germany (November 12 to 15), under the motto “Change Forward – Grasping the Future”. The focus of the trade fair presence will be on groundbreaking connection technologies as well as solutions for charging infrastructure, renewable energies, and DC solutions for industry within the All Electric Society.

Phoenix Contact offers a well-designed housing for diverse electronics with its new MCS series. It is sure to impress at all stages, from installation of the PCB and simple mounting to maintenance of the device. Modular in design, the housing offers exceptional practicality.

Phoenix Contact is introducing a PV panel-based housing solution with several performance classes up to 190 Wp. The POS (Pico Off-grid System) includes a water- and impact-protected plastic housing, a stainless steel pole mount, and a solar panel. Computers, communication units, batteries, and more can be added to create self-sufficient solutions for field use.

Phoenix Contact is focusing on a successive change towards greater sustainability in its products. Solutions are already available in the PCB terminal blocks, connectors, and electronics housings product categories that have significantly improved carbon footprints due to process optimizations and the use of sustainable materials.

With the new generation of OCS outdoor housings, Phoenix Contact is extending its portfolio of field housings. The three new, larger housing versions simplify the installation of several electronic components in one housing.

With the ME-IO and ICS housing series, Phoenix Contact offers a comprehensive portfolio for device development. The new extension items for the DIN rail connectors make it even easier to implement an entire system consisting of several modules.

With the ICS housing series, Phoenix Contact offers a wide range of housing systems for future-oriented automation devices.

Embedded systems and single-board computers are becoming increasingly powerful with more compact dimensions. To facilitate reliable operation, coordinated heat dissipation concepts are required. Phoenix Contact therefore offers an integrated heatsink/heat spreader combination for the Universal Case System (UCS) housing series.

Online thermal simulation from Phoenix Contact offers new possibilities for the suitable design of industrial electronics as early as the development phase.

For the modular electronics housings in the ICS series from Phoenix Contact, fillers in depths of 67.5, 90, and 112.5 mm are now also available.