cULus Recognized
Approval ID: E118976| Nominal Voltage UN | Nominal Current IN | Cross Section AWG | Cross Section mm2 | |
|---|---|---|---|---|
| 30 V | 3 A |
FQ 2,54D/ 10-PH-1-BT
-
Pin strip
1156939
SMD pin header, nominal current: 3 A, Test voltage: 500 V AC, number of positions: 10, pitch: 2.54 mm, color: black, contact surface: Gold, type of contact: Pin, mounting: SMD soldering
This product needs further products for operation.
Mandatory Accessories
Product Details
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Product type | SMD pin header |
| Product family | FQ 2,54D/...-PH |
| Number of positions | 10 |
| Pitch | 2.54 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
| Nominal current IN | 3 A IEC 60512-5-2:2002-02 (at 20°C 80-pos.) |
| Degree of pollution | 3 |
| Contact resistance | 20 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003 |
| Dimensional drawing |
|
| Pitch | 2.54 mm |
| Width [w] | 12.7 mm |
| Height [h] | 6.28 mm |
| Length [l] | 16.1 mm |
| Installed height | 5.08 mm |
| Application | |
| Contact cover | 0.4 mm |
| Wipe length | 1.3 mm |
| PCB design | |
| Pad geometry | 1.3 x 2.8 mm |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color () | () |
| Connection 1 | |
| Insulating material | PA |
| CTI according to IEC 60112 | 600 |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 80 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 1 GΩ |
| Air clearances and creepage distances | | |
| Insulating material group | I |
| Minimum value for clearance and creepage distance | 0.4 mm |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 100 |
| Insertion strength per pos. approx. | 2.9 N |
| Withdraw strength per pos. approx. | 2.9 N |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 55 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Sweep speed | 181 m/s² |
| Test duration per axis | 2 h |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 20 mΩ |
| Contact resistance R2 | 30 mΩ |
| Insertion/withdrawal cycles | 100 |
| Insulation resistance, neighboring positions | > 1 GΩ |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Type of packaging | Tube magazine |
Your advantages
Reliable mechanical and electrical connections thanks to the double-sided contact system
Designed for integration into the SMT soldering process
Clear and cost-optimized design
Suitable for a multitude of applications
Stacked, coplanar or orthogonal PCB connections enable maximum flexibility in the device