Printed circuit board terminal - PTDA 2,5/11-5,0 1725419

PCB terminal block, nominal current: 24 A, rated voltage (III/2): 400 V, nominal cross section: 2.5 mm2, Number of potentials: 11, Number of rows: 1, Number of positions per row: 11, product range: PTDA 2,5/, pitch: 5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: green, Pin layout: Linear double pinning, Solder pin [P]: 3.5 mm, type of packaging: packed in cardboard

Product Details





Electrical properties
Rated surge voltage (III/2) 4 kV
Pollution degree 2
Rated voltage (III/2) 400 V
Air clearances and creepage distances |
minimum clearance value - non-homogenous field (II/2) 3 mm
minimum creepage distance (III/3) 4 mm
minimum clearance value - non-homogenous field (III/3) 3 mm
Insulating material group I
minimum clearance value - non-homogenous field (III/2) 3 mm
minimum creepage distance (III/2) 2 mm
Comparative tracking index (IEC 60112:2003-01) CTI 600
minimum creepage distance (II/2) 3.2 mm
Rated surge voltage (II/2) 4 kV
Rated insulation voltage (III/3) 320 V
Rated insulation voltage (III/2) 400 V
Specification IEC 60664-1:2007-04
Rated insulation voltage (II/2) 630 V
Rated surge voltage (III/3) 4 kV
Rated surge voltage (III/2) 4 kV
Temperature-rise test
Specification IEC 60998-2-1:2002-12
Requirement temperature-rise test Increase in temperature ≤ 45 K

Rated surge voltage (III/3) 4 kV
Rated surge voltage (III/2) 4 kV
Rated voltage (II/2) 630 V
Nominal current IN 24 A
24 A
Maximum load current 24 A
Rated surge voltage (II/2) 4 kV
Nominal voltage UN 320 V
Rated voltage (III/2) 400 V

Type of packaging packed in cardboard

Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (assembly) -5 °C ... 100 °C
Ambient temperature (storage/transport) -40 °C ... 70 °C
Glow-wire test
Temperature 850 °C
Time of exposure 5 s
Specification IEC 60998-1:2002-12
Vibration test
Amplitude 0.35 mm (10 - 60.1 Hz)
Test duration per axis 2.5 h
Frequency 10 - 150 - 10 Hz
Specification IEC 60068-2-6:1995-03
Sweep speed 1 octave/min
5 g (60.1 - 150 Hz)

Dimensional drawing
Hole diameter 1.3 mm
Installed height 16 mm
Pin dimensions 1 x 0.4 mm
Length 16 mm
Length of the solder pin 3.5 mm
3.5 mm
Pitch 5 mm
Height 19.5 mm
Width 55 mm
PCB design
Pin spacing 5 mm

Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (assembly) -5 °C ... 100 °C
Ambient temperature (storage/transport) -40 °C ... 70 °C

Test for conductor damage and slackening
Specification IEC 60998-2-2:2002-12
Result Test passed
Pull-out test
Conductor cross section/conductor type/tractive force setpoint/actual value 0.2 mm2 / solid / > 10 N
0.2 mm2 / flexible / > 10 N
2.5 mm2 / solid / > 50 N
2.5 mm2 / flexible / > 50 N
Specification IEC 60998-2-2:2002-12
Flexion test
Specification IEC 60998-2-2:2002-12
Result Test passed
Connection test
Specification IEC 60998-2-2:2002-12
Result Test passed

Environmental Product Compliance
China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Connection technology
Nominal cross section 2.5 mm2
Conductor connection
2 conductors with same cross section, solid 0.2 mm2 ... 2.5 mm2
Conductor cross section AWG 24 ... 14
Conductor cross section flexible, with ferrule without plastic sleeve 0.5 mm2 ... 2.5 mm2
2 conductors with same cross section, flexible, with ferrule without plastic sleeve 0.5 mm2 ... 2.5 mm2
Conductor cross section solid 0.2 mm2 ... 2.5 mm2
Stripping length 10 mm
2 conductors with the same cross section, flexible, with TWIN ferrule with plastic sleeve 0.5 mm2 ... 1 mm2
Connection method Push-in spring connection
2 conductors with same cross section, flexible 0.2 mm2 ... 2.5 mm2
Conductor cross section, flexible, with ferrule, with plastic sleeve 0.5 mm2 ... 1 mm2
Conductor cross section flexible 0.2 mm2 ... 2.5 mm2

Material data - housing
Insulating material group I
Temperature for the ball pressure test according to EN 60695-10-2 125 °C
Glow wire flammability index GWFI according to EN 60695-2-12 850
CTI according to IEC 60112 600
Housing color green (6021)
Insulating material PA
Flammability rating according to UL 94 V0
Glow wire ignition temperature GWIT according to EN 60695-2-13 775
Material data - contact
Metal surface terminal point (top layer) Tin (4 - 8 µm Sn)
Contact material Cu alloy
Surface characteristics Tin-plated
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Metal surface soldering area (top layer) Tin (4 - 8 µm Sn)

Number of positions 11
Number of potentials 11
Number of levels 1
Number of connections 22
Pin layout Linear double pinning


Order Key 1725419
Packing unit 50 pc
Minimum order quantity 1 pc
Note Made to Order (non-returnable)
Catalog Page Page 409 (C-1-2013)
GTIN 4046356129343
Weight per Piece (including packing) 17.3 GRM
Weight per Piece (excluding packing) 17.3 GRM
Customs tariff number 85369010
Country of origin BG



CCA

Approval Specification Data
Nominal voltage UN 250 V
Nominal current IN 24 A
AWG/kcmil 0.2-2.5
Min. cross section 0.2 mm²
Max. cross section 2.5 mm²

IECEE CB Scheme

Approval Specification Data
Nominal voltage UN 250 V
Nominal current IN 24 A
AWG/kcmil 0.2-2.5
Min. cross section 0.2 mm²
Max. cross section 2.5 mm²

VDE Gutachten mit Fertigungsüberwachung

Approval Specification Data
Nominal voltage UN 250 V
Nominal current IN 24 A
AWG/kcmil 0.2-2.5
Min. cross section 0.2 mm²
Max. cross section 2.5 mm²

EAC

cULus Recognized

Approval Specification Data
Usegroup B D
Nominal voltage UN 300 V 300 V
Nominal current IN 15 A 10 A
AWG/kcmil 0.2-2.5 0.2-2.5
Min. cross section 24 mm² 24 mm²
Max. cross section 14 mm² 14 mm²

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Your advantages

Time saving push-in connection, tools not required
Defined contact force ensures that contact remains stable over the long term
Potentials can be easily looped through – ideal for BUS applications
Quick and convenient testing using integrated test option
Rounded type for individual device design
Two solder pins reduce the mechanical strain on the soldering spots