| Product type | Printed circuit board terminal |
| Product family | MKDS 1/..-HT |
| Product line | COMBICON Terminals S |
| Type | PC termination block |
| Number of positions | 4 |
| Pitch | 3.81 mm |
| Number of connections | 4 |
| Number of rows | 1 |
| Number of potentials | 4 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 13.5 A |
| Nominal voltage UN | 200 V |
| Rated voltage (III/3) | 63 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 200 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 200 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Connection technology | |
| Type | PC termination block |
| Nominal cross section | 1.5 mm² |
| Conductor connection | |
| Connection method | Screw connection with tension sleeve |
| Conductor cross-section rigid | 0.14 mm² ... 1.5 mm² |
| Conductor cross-section flexible | 0.14 mm² ... 1.5 mm² |
| Conductor cross-section AWG | 26 ... 16 |
| Conductor cross-section flexible, with ferrule without plastic sleeve | 0.25 mm² ... 0.5 mm² |
| Conductor cross-section, flexible, with ferrule, with plastic sleeve | 0.25 mm² ... 0.5 mm² |
| 2 conductors with same cross section, solid | 0.14 mm² ... 0.5 mm² |
| 2 conductors with same cross section, flexible | 0.14 mm² ... 0.34 mm² |
| Stripping length | 5 mm |
| Drive form screw head | Slotted (L) |
| Tightening torque | 0.22 Nm ... 0.25 Nm |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 3 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface terminal point (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface terminal point (middle layer) | Nickel (2 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (2 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | PA |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 250 - 399 |
| Flammability rating according to UL 94 | V0 |
| Note on application | For safe conductor connection, always adhere to a defined tightening torque. Particularly in the case of PCB terminal blocks with two or three positions, the individual solder pin for each contact point cannot compensate for this. That is why the terminal blocks must be supported during conductor connection (held with one hand, support on the housing). |
| Dimensional drawing |
|
| Pitch | 3.81 mm |
| Width [w] | 15.23 mm |
| Height [h] | 12 mm |
| Length [l] | 7.3 mm |
| Installed height | 8.5 mm |
| Solder pin length [P] | 3.5 mm |
| Pin dimensions | 0.5 x 0.9 mm |
| PCB design | |
| Pin spacing | 3.5 mm |
| Hole diameter | 1.1 mm |
| Test for conductor damage and slackening | |
| Specification | IEC 60999-1:1999-11 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60999-1:1999-11 |
| Conductor cross-section/conductor type/tractive force setpoint/actual value | 0.14 mm² / solid / > 10 N |
| 0.14 mm² / flexible / > 10 N | |
| 1.5 mm² / solid / > 40 N | |
| 1.5 mm² / flexible / > 40 N | |
| Temperature-rise test | |
| Specification | IEC 60947-7-4:2019-01 |
| Requirement temperature-rise test | The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. |
| Short-time withstand current | |
| Specification | IEC 60947-7-4:2019-01 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60947-1:2007-06 + A1:2010-12 + A2:2014-09 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 250 - 399 |
| Rated insulation voltage (III/3) | 63 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2 mm |
| Rated insulation voltage (III/2) | 200 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 2 mm |
| Rated insulation voltage (II/2) | 200 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-10:2013-04 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Aging | |
| Specification | IEC 60947-7-4:2019-01 |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 105 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
| Outer packaging type | Dry bag |
| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| B | ||||
| Only flexible conductors | 300 V | 13.5 A | 30 - 16 | |
| Standard | 300 V | 10 A | 30 - 16 | |
| D | ||||
| Only flexible conductors | 150 V | 13.5 A | 30 - 16 | |
| Standard | 300 V | 10 A | 30 - 16 | |
| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| keine | ||||
| 200 V | 17.5 A | 0.2 - 1.5 | ||
