Electronics housings with thermal simulation
Electronics housings with corresponding heatsinks and optimized PCB layouts offer optimal cooling and increased device performance. For BC, ME-IO, ICS, and UCS series electronics housings, Phoenix Contact therefore offers a combination of suitable heatsinks and a unique simulation service that maximizes the thermal efficiency of the device.
Through the flexible combination of aluminum heatsinks and plastic housings, these hybrid systems provide the ideal solution for the thermal optimization of devices. The modular design and tailor-made heatsinks for the respective housing systems enable targeted heat dissipation in various applications. The coordinated component arrangements and precise cooling ensure an optimum space/performance ratio.
The integration of aluminum heatsinks in plastic housings ensures maximum heat dissipation without the use of additional active cooling systems. This is therefore ideal for applications where maximum performance is required.
Electronics housings from Phoenix Contact with aluminum heatsinks create the right conditions for compact applications. This is because the more efficient the cooling, the higher the possible power density and the more demanding the ambient conditions can be – while also ensuring maximum utilization of the available installation space.
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