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The electronics housings from the ME-IO series are particularly suitable for applications with a limited amount of installation space and high function requirements. Tailor-made modules, such as controllers and I/O modules, can be easily assembled thanks to their modular design. The Push-in connection technology and compact design enable the implementation of individual devices with up to 54 positions per overall width of 18.8 mm.
DIN rail housing, Lower housing part with metal foot catch, with vents, width: 37.89 mm, height: 120.6 mm, depth: 82.85 mm, color: light gray (similar RAL 7035), cross connection: DIN rail bus connector (optional), number of positions cross connector: 5 or 8
DIN rail housing, with front connection for DIN rail mounting, color: light gray (similar RAL 7035), width: 18.9 mm, height: 124 mm, depth: 76.5 mm, incl. 8 front connection terminal blocks, 4-pos., Push-in, for 2.5 mm2, nominal current: 8 A, 300 V, PCB surface: 6500 mm2
PCB connector, nominal cross section: 2.5 mm2, color: light gray, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Socket, number of potentials: 4, number of rows: 2, number of positions: 4, number of connections: 4, product range: HSCP-SP 2,5-.., pitch: 5 mm, connection method: Push-in spring connection, conductor/PCB connection direction: 0 °, locking clip: - Locking clip, plug-in system: HSC 2,5, locking: without, mounting method: without, type of packaging: packed in cardboard, Color of the spring lever: orange
DIN rail housing, Filler plug, for closing the Lock and Release area, width: 11.7 mm, height: 16.1 mm, depth: 10.6 mm, color: light gray (similar RAL 7035)
PCB connector, nominal cross section: 2.5 mm2, color: light gray, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Socket, number of potentials: 2, number of rows: 2, number of positions: 2, number of connections: 2, product range: HSCP-SP 2,5-.., pitch: 5 mm, connection method: Push-in spring connection, conductor/PCB connection direction: 0 °, locking clip: - Locking clip, plug-in system: HSC 2,5, locking: without, mounting method: without, type of packaging: packed in cardboard, Partially assembled version
DIN rail housing, 2U for marking lid, Housing cover, width: 18.9 mm, height: 21.9 mm, depth: 26 mm, color: light gray (similar RAL 7035)
DIN rail housing, 2U, Housing cover, width: 18.9 mm, height: 21.8 mm, depth: 26 mm, color: light gray (similar RAL 7035)
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 12, number of rows: 2, number of positions: 12, number of connections: 12, product range: HSCH 1,5/..-G, pitch: 3.45 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: HSC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard
DIN rail housing, 9U, Lock and Release system, width: 16.1 mm, height: 111.8 mm, depth: 8.8 mm, color: orange (similar RAL 2003)
PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 8, number of rows: 2, number of positions: 8, number of connections: 8, product range: HSCH 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: HSC 2,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard
Complex controllers and I/O modules require high data transmission speeds. ME-IO housings in compact design enable almost 200 positions with Push-in front connection technology in one device. In addition, DIN rail connectors ensure efficient module communication. With signal indicators and operating elements like displays, it is possible to implement custom solutions.
Maximize power density in your devices with passive cooling solutions and thermally optimized PCB layouts in ME-IO electronics housings: from configuration and comprehensive thermal simulations to implementation – ideal for powerful and miniaturized applications in control electronics.
Tailor-made housing solution for modular control systems
Up to four overall module widths of 18.8 mm, 37.6 mm, 56.4 mm, and 75.2 mm enable device manufacturers to realize a wide range of applications. In addition, there are housing versions with a module depth for a PCB area up to a maximum of 6,580 mm² and up to 8,510 mm² per 18.8 mm module width. Printed circuit boards can be installed vertically and horizontally to the DIN rail.
Push-in front connection technology and a compact design enable you to implement devices with up to 54 positions per overall width of 18.8 mm. This high connection density is made possible by 4- and 6-pos. connectors with 3.45 mm and 5.0 mm pitch. You can tailor the connection technology to your own design. USB, mini USB, RJ45, D-SUB, and SD cards are available for this purpose. You can use Blockbelts to mechanically group connector types in any way.
Lock and release connectors quickly and easily with the lock-and-release system. This allows you to replace modules without time-consuming connection work – no special tools are required.
Versatile coding elements in the connector and header provide device manufacturers with increased mating reliability in connection technology.
The 8-pos. TBUS 8 DIN rail connector provides up to four parallel and serial contacts for easy module-to-module communication. In addition, the TBUS 8 allows you to combine the ICS series housings with the ME-IO series housings in an application.
Our development kits provide a quick way for you to develop your prototypes and pre-series devices. The kits contain complete housing solutions with integrated connection technology and corresponding perfboard PCBs. You can implement entire device systems with specific bus connectors. Configure your development kit in our e-shop and get started straight away on your device development project.
Heatsinks are currently available for the ICS (Industrial Case System, for the DIN rail) and UCS (Universal Case System, for outdoor use) housing series.
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.
The maximum temperature has a particularly high impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 mm x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.
The ME-IO is the housing system with the high-position front connection technology. This allows you to assemble multifunctional applications step-by-step.
Electronics housings are an elementary part of a device. They determine its appearance and protect the electronics from external influences. In addition, they enable assembly in superordinate units. Device manufacturers must therefore pay attention to many details, and not only in the design, but also in the choice of housing when it comes to materials and quality testing. This brochure provides you with all the details.
