MSTBA 2,5/ 3-G-5,08THTABGYAU R
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PCB header
1731125
PCB headers, nominal cross section: 2.5 mm2, color: agate gray, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Au, contact connection type: Pin, number of rows: 1, number of positions: 3, product range: MSTBA 2,5/..-G-THT, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: 32 mm wide tape, For user information and design recommendations for through-hole reflow technology, go to: Downloads
Product details
| Product type | PCB headers |
| Product family | MSTBA 2,5/..-G-THT |
| Product line | COMBICON Connectors M |
| Number of positions | 3 |
| Pitch | 5.08 mm |
| Number of rows | 1 |
| Mounting type | without |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Fitting of components | |
| Partial assembly | No |
| Properties | |
| Nominal current IN | 12 A |
| Nominal voltage UN | 320 V |
| Rated voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| Rated voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | partially gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 µm - 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (2 µm - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 µm - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1 µm - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | agate gray (7038) |
| Insulating material | PA GF |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 250 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing |
|
| Pitch | 5.08 mm |
| Width [w] | 17.24 mm |
| Height [h] | 11.8 mm |
| Length [l] | 12 mm |
| Installed height | 8.57 mm |
| Solder pin length [P] | 3.23 mm |
| Pin dimensions | 1 x 1 mm |
| PCB design | |
| Hole diameter | 1.4 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Rated insulation voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value - non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 4 mm |
| Rated insulation voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value - non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 3.2 mm |
| Rated insulation voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value - non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 4 mm |
| Ambient conditions | |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Dimensional drawing |
|
| Type of packaging | 32 mm wide tape |
| [W] tape width | 32 mm |
| [W2] coil overall dimension | ≤ 38.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Dry bag |
Compatible products
Your advantages
Gold-plated contacts ensure transfer quality remains stable over the long term
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
Well-known mounting principle allows worldwide use
Plug-in direction parallel to the PCB
Closed contour for optimum stability of the plug-in connection