cULus Recognized
Approval ID: E60425-20110128| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| B | ||||
| 150 V | 8 A | |||
| D | ||||
| 150 V | 8 A | |||
MCDNV 1,5/ 8-G1-3,5 P26THRGNAU
-
PCB header
1704929
PCB headers, nominal cross section: 1.5 mm2, color: green, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 16, number of rows: 2, number of positions: 8, number of connections: 16, product range: MCDNV 1,5/..-G1-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 1,5 - MCDN 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: no, type of packaging: packed in cardboard, For user information and design recommendations for through-hole reflow technology, go to: Downloads
Product details
| Product type | PCB headers |
| Product family | MCDNV 1,5/..-G1-THR |
| Product line | COMBICON Connectors S |
| Type | Component suitable for through hole reflow |
| Number of positions | 8 |
| Pitch | 3.5 mm |
| Number of connections | 16 |
| Number of rows | 2 |
| Number of potentials | 16 |
| Mounting type | no |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Fitting of components | |
| Partial assembly | No |
| Properties | |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Completely gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 µm - 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (1 µm - 3 µm Ni) |
| Metal surface soldering area (top layer) | Gold (0.8 µm - 1.4 µm Au) |
| Metal surface soldering area (middle layer) | Nickel (1 µm - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | green (6021) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Dimensional drawing |
|
| Pitch | 3.5 mm |
| Width [w] | 29.5 mm |
| Height [h] | 13.3 mm |
| Length [l] | 16 mm |
| Installed height | 15.9 mm |
| Solder pin length [P] | 2.6 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| PCB design | |
| Pin spacing | 3.50 mm |
| Hole diameter | 1.3 mm |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2.5 mm |
| Ambient conditions | |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Type of packaging | packed in cardboard |
Compatible products
Your advantages
Gold-plated contacts ensure transfer quality remains stable over the long term
Designed for integration into the SMT soldering process
Vertical connection enables multi-row arrangement on the PCB
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies