Feed-through header - DFK-MSTB 2,5/12-G 0707196

Feed-through header, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, number of potentials: 12, Number of rows: 1, Number of positions per row: 12, number of connections: 12, product range: DFK-MSTB 2,5/..-G, pitch: 5 mm, connection method: Solder/Slip-on connection, mounting: Direct mounting, pin layout: Linear pinning, solder pin [P]: 9.3 mm, plug-in system: CLASSIC COMBICON, Pin connector pattern alignment: Standard, Locking: without, mounting: without, type of packaging: packed in cardboard, accessory order no. 5030172 can only be used in conjunction with MSTB 2,5/...ST and MSTBT 2,5/...ST.


Product Details





Electrical properties
Rated surge voltage (III/2) 4 kV
Pollution degree 2
Rated voltage (III/2) 320 V
Air clearances and creepage distances |
minimum clearance value - non-homogenous field (II/2) 3 mm
minimum creepage distance (III/3) 4 mm
minimum clearance value - non-homogenous field (III/3) 3 mm
Insulating material group I
minimum clearance value - non-homogenous field (III/2) 3 mm
minimum creepage distance (III/2) 3 mm
Comparative tracking index (IEC 60112:2003-01) CTI 600
minimum creepage distance (II/2) 3.2 mm
Rated surge voltage (II/2) 4 kV
Rated insulation voltage (III/3) 320 V
Rated insulation voltage (III/2) 320 V
Specification IEC 60664-1:2007-04
Rated insulation voltage (II/2) 630 V
Rated surge voltage (III/3) 4 kV
Rated surge voltage (III/2) 4 kV

Rated surge voltage (III/3) 4 kV
Rated surge voltage (III/2) 4 kV
Rated voltage (II/2) 630 V
Nominal current IN 12 A
12 A
Maximum load current 12 A
Rated surge voltage (II/2) 4 kV
Nominal voltage UN 320 V
Rated voltage (III/2) 320 V

Type of packaging packed in cardboard
packed in cardboard

Ambient conditions
Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (assembly) -5 °C ... 100 °C
Ambient temperature (storage/transport) -40 °C ... 70 °C

Dimensional drawing
Hole diameter 3.2 mm
Installed height 20.2 mm
Dimensions of slip-on connection 2,8 x 0,8 mm
Length 17.5 mm
Length of the solder pin 9.3 mm
9.3 mm
Pitch 5 mm
Height 29.5 mm
Width 80 mm

Material data - housing
Insulating material group I
CTI according to IEC 60112 600
Housing color green (6021)
Insulating material PA
Flammability rating according to UL 94 V2
Material data - contact
Contact material Cu alloy
Metal surface soldering area (middle layer) Nickel (2 - 3 µm Ni)
Surface characteristics Tin-plated
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Metal surface contact area (top layer) Tin (5 - 7 µm Sn)
Metal surface contact area (middle layer) Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer) Tin (5 - 7 µm Sn)

Number of positions 12
Type Feed-through header
Number of potentials 12
Number of levels 1
Number of connections 12
Connector system CLASSIC COMBICON
Pin layout Linear pinning
Mounting flange without


Order Key 0707196
Packing unit 50 pc
Minimum order quantity 1 pc
Sales Key 051
Catalog Page Page 352 (C-1-2013)
GTIN 4017918003968
Weight per Piece (including packing) 12,1 GRM
Weight per Piece (excluding packing) 11,0 GRM
Customs tariff number 85366930
Country of origin DE



VDE Zeichengenehmigung

Approval Specification Data
Nominal voltage UN 250 V
Nominal current IN 12 A

CSA

Approval Specification Data
Usegroup B D
Nominal voltage UN 300 V 300 V
Nominal current IN 15 A 10 A

IECEE CB Scheme

Approval Specification Data
Nominal voltage UN 250 V
Nominal current IN 12 A

EAC

cULus Recognized

Approval Specification Data
Usegroup B D
Nominal voltage UN 300 V 300 V
Nominal current IN 15 A 10 A

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values


Your advantages

Cable connection on the inside of the device enables flexible positioning of the panel feed-through
Free choice – permanent solder connection or standardized slip-on connection
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies