High density I/O options with one housing

The ME-IO housing system from Phoenix Contact offers up to 36 push-in connection points on a slim, 18-mm design. Its scalable design makes it easy to create your own control platform. The back-plane communication for the ME-IO housing is also compatible with our ME and ME-MAX style housings, eliminating the need for wiring between modules.

Our ME-IO has been designed to be easily customizable, allowing you to create a solution for any application. Various cover sizes and configurations make it easy to accommodate common electronic components, such as a D-SUB, RJ45, LEDs, or USBs.

For applications with a limited amount of installation space, the push-in front connection and compact design make our ME-IO housing system an ideal choice.

ME-IO housing features:

• Easy installation and removal
• High density integrated connectors
• Wire quickly, without tools
• Include the latest communication interfaces: USB, RJ45, and D-SUB
• Scalable design