CUC-USB3.1-J1ST-AH/UCF-SMD
-
USB PCB connectors
1332645
USB PCB connectors, degree of protection: IP20, number of positions: 16, 480 Mbps, material: Metal, connection method: Solder connection, USB 2.0
Product details
Product type | Data connector (device side) |
Type | USB-C |
Sensor type | USB 2.0 |
Number of positions | 16 |
Connection profile | USB-C |
Type of packaging | Tape and Reel |
[W] tape width | 24.00 mm |
[A] coil diameter | 330.00 mm |
Number of slots | 1 |
Type | Socket |
Shielded | yes |
Data management status | |
Article revision | 00 |
Insulation characteristics | |
Overvoltage category | I |
Degree of pollution | 2 |
Rated voltage (III/2) | 20 V |
Rated surge voltage (III/2) | 1500 V |
Rated current | 5 A |
Contact resistance | 40 mΩ |
Frequency range | 10 Hz ... 55 Hz |
Insulation resistance | 100 MΩ |
Transmission medium | Copper |
Transmission characteristics (category) | USB 2.0 |
Transmission speed | 480 Mbps |
Power transmission | 100 W |
Connection technology | |
Connection method | Solder connection |
Width | 8.94 mm |
Height | 3.26 mm |
Length | 7.3 mm |
Orientation to PCB | 90.00 ° |
Color of the housing part | black |
Flammability rating according to UL 94 | V0 |
Housing material | Metal |
Contact material | Copper alloy |
Contact surface material | Gold over nickel |
Contact carrier material | LCP |
Test voltage Core/Core | 100 V |
Test voltage Core/Shield | 100.00 V |
Acceleration | 3.1 m/s² |
Halogen-free | yes |
Mechanical data | |
Insertion/withdrawal cycles | > 10000 |
Insertion force per signal contact | 20.00 N |
Extraction force per signal contact | < 8 N |
Test specification | |
Specification | EIA 364-1000 |
Frequency | 10-55 Hz |
Sweep speed | 1 octave/min |
Amplitude | 1.52 mm |
Test duration | 2.00 h |
Contact resistance R1 | 40.00 mΩ |
Test specification | |
Specification | 60068-2-27 |
Acceleration | 30.00 g |
Number of shocks per direction | 18.00 |
Ambient conditions | |
Degree of protection | IP20 |
Ambient temperature (operation) | -55 °C ... 85 °C |
Mounting type | SMD soldering |
Processing notes | |
Process | SMD |
Moisture Sensitive Level | MSL 1 |
Classification temperature Tc | 260 °C |
Solder cycles in the reflow | 3 |
Item number | 1332645 |
Packing unit | 1,000 pc |
Minimum order quantity | 1,000 pc |
Sales key | AB14 |
Product key | ABNDAC |
GTIN | 4063151629724 |
Weight per piece (including packing) | 0.811 g |
Weight per piece (excluding packing) | 22.22 g |
Customs tariff number | 85366930 |
Country of origin | CN |
ECLASS
ECLASS-11.0 | 27440390 |
ECLASS-12.0 | 27440390 |
ECLASS-13.0 | 27460201 |
ETIM
ETIM 9.0 | EC002637 |
UNSPSC
UNSPSC 21.0 | 39121400 |
EU RoHS | |
Fulfills EU RoHS substance requirements | Yes (No exemptions) |
China RoHS | |
Environment friendly use period (EFUP) |
EFUP-E
No hazardous substances above the limits
|
EU REACH SVHC | |
REACH candidate substance (CAS No.) | No substance above 0.1 wt% |
Your advantages
Optimized for SMD reflow soldering processes
Can be processed automatically thanks to tape-on-reel packaging
PHOENIX CONTACT
586 Fulling Mill Road, Middletown, PA 17057