PCB terminal block - PTSM 0,5/ 6-2,5-V SMD WH R44
1814744

PCB terminal block, nominal current: 6 A, rated voltage (III/2): 160 V, nominal cross section: 0.5 mm2, number of potentials: 6, number of rows: 1, number of positions per row: 6, product range: PTSM 0,5/..-V-SMD WH, pitch: 2.5 mm, connection method: Push-in spring connection, mounting: SMD soldering, conductor/PCB connection direction: 90 °, color: signal white, Pin layout: Linear pad geometry, Solder pin [P]: 2 mm, number of solder pins per potential: 1, type of packaging: 44 mm wide tape


Product Details




Product line COMBICON Terminals XS
Product type Printed circuit board terminal
Number of positions 6
Pitch 2.5 mm
Number of connections 6
Number of rows 1
Number of potentials 6
Pin layout Linear pad geometry

Nominal current IN 6 A
Nominal voltage UN 160 V
Pollution degree 3
Rated voltage (III/3) 63 V
Rated surge voltage (III/3) 2.5 kV
Rated voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV

Connection technology
Nominal cross section 0.5 mm²
Conductor connection
Connection method Push-in spring connection
Conductor cross section solid 0.14 mm² ... 0.5 mm²
Conductor cross section flexible 0.2 mm² ... 0.5 mm² (up to 0.75 mm² supported, with a stripping length of 7.5 mm and a rated insulation voltage of 32 V at III/2)
Conductor cross section AWG 26 ... 20
Conductor cross section flexible, with ferrule without plastic sleeve 0.25 mm² ... 0.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve 0.25 mm² ... 0.34 mm²
Cylindrical gauge a x b / diameter - / 1.2 mm
Stripping length 6 mm

Mounting type SMD soldering
Processing notes
Process Reflow soldering
Moisture Sensitive Level MSL 1
Classification temperature Tc 260 °C
Solder cycles in the reflow 3

Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics hot-dip tin-plated
Metal surface terminal point (top layer) Tin (4 - 8 µm Sn)
Metal surface soldering area (top layer) Tin (4 - 8 µm Sn)
Material data - housing
Housing color signal white (9003)
Insulating material PA GF
Insulating material group I
CTI according to IEC 60112 600
Flammability rating according to UL 94 V0
Material data – actuating element
Color of the actuating lever white (9010)

Note on application Pick and place pads may protrude beyond the components. The PCB layout must ensure that collisions are avoided when components are assembled.

Dimensional drawing
Pitch 2.5 mm
Width [w] 20.1 mm
Height [h] 9 mm
Length [l] 7 mm
Installed height 9 mm
Solder pin length [P] 2 mm
PCB design
Pad geometry 1.4 x 3.4 mm
Pin spacing 2.5 mm

Connection test
Specification IEC 60998-2-2:2002-12
Result Test passed
Test for conductor damage and slackening
Specification IEC 60998-2-2:2002-12
Result Test passed
Pull-out test
Specification IEC 60998-2-2:2002-12
Conductor cross section/conductor type/tractive force setpoint/actual value 0.14 mm² / solid / > 10 N
0.2 mm² / flexible / > 10 N
0.5 mm² / solid / > 20 N
0.75 mm² / flexible / > 30 N
Flexion test
Specification IEC 60998-2-2:2002-12
Result Test passed

Temperature-rise test
Specification IEC 60998-2-1:2002-12
Requirement temperature-rise test Increase in temperature ≤ 45 K
Insulation resistance
Specification IEC 60998-1:2002-12
Insulation resistance, neighboring positions > 5 MΩ
Air clearances and creepage distances |
Specification IEC 60664-1:2007-04
Insulating material group I
Comparative tracking index (IEC 60112) CTI 600
Rated insulation voltage (III/3) 63 V
Rated surge voltage (III/3) 2.5 kV
minimum clearance value - non-homogenous field (III/3) 1.5 mm
minimum creepage distance (III/3) 1.6 mm
Rated insulation voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV
minimum clearance value - non-homogenous field (III/2) 1.5 mm
minimum creepage distance (III/2) 1.5 mm
Rated insulation voltage (II/2) 320 V
Rated surge voltage (II/2) 2.5 kV
minimum clearance value - non-homogenous field (II/2) 1.5 mm
minimum creepage distance (II/2) 1.6 mm

Vibration test
Specification IEC 60068-2-6:2007-12
Frequency 10 - 150 - 10 Hz
Sweep speed 1 octave/min
Amplitude 0.35 mm (10 - 60.1 Hz)
Sweep speed 5g (60.1 - 150 Hz)
Test duration per axis 2.5 h
Glow-wire test
Specification IEC 60998-1:2002-12
Temperature 850 °C
Time of exposure 5 s
Ambient conditions
Ambient temperature (operation) -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport) -40 °C ... 70 °C
Relative humidity (storage/transport) 30 % ... 70 %
Ambient temperature (assembly) -5 °C ... 100 °C

Dimensional drawing
Type of packaging 44 mm wide tape
[W] tape width 44 mm
[W2] coil overall dimension 50.4 mm
[A] coil diameter 330 mm
Outer packaging type Transparent-Bag
ESD level (D) electrostatically conductive
Specification DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07

Item number 1814744
Packing unit 1 pc
Minimum order quantity 400 pc
Sales Key A03
Product Key AAKDAD
Catalog Page Page 393 (C-1-2013)
GTIN 4046356760492
Weight per Piece (including packing) 2.912 g
Weight per Piece (excluding packing) 2.3 g
Customs tariff number 85369010
Country of origin IN


ECLASS

ECLASS-9.0 27440401
ECLASS-10.0.1 27440401
ECLASS-11.0 27460101

ETIM

ETIM 8.0 EC002643

UNSPSC

UNSPSC 21.0 39121400

UL Recognized

Approval ID: E118976-20130619
Approval Specification Data
Nominal Voltage UN Nominal Current IN Cross Section AWG Cross Section mm2
Use group B
150 V 5 A 26 - 18

EAC

Approval ID: B.01687

cULus Recognized

Approval ID: E60425-20030527
Approval Specification Data
Nominal Voltage UN Nominal Current IN Cross Section AWG Cross Section mm2
Use group B
150 V 5 A 26 - 20

VDE Zeichengenehmigung

Approval ID: 40048725

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Your advantages

White design: Stable color when welding and during use
Time saving push-in connection, tools not required
Defined contact force ensures that contact remains stable over the long term
High current carrying capacity of 6 A in very compact dimensions
Designed for integration into the SMT soldering process
Vertical connection enables multi-row arrangement on the PCB
Additional solder anchors reduce the mechanical strain on the soldering spots