GMSTB 2,5/ 8-GFSO-7,62 AU EMC
-
PCB header
1757264
PCB headers, nominal cross section: 2.5 mm2, color: green, contact surface: Au, contact connection type: Pin, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: GMSTB 2,5/..-GFSO, pitch: 7.62 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting method: Threaded flange, type of packaging: packed in cardboard
Product details
| Product type | PCB headers |
| Product family | GMSTB 2,5/..-GFSO |
| Product line | COMBICON Connectors Special |
| Number of positions | 8 |
| Pitch | 7.62 mm |
| Number of connections | 8 |
| Number of rows | 1 |
| Number of potentials | 8 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
| Flange | |
| Tightening torque | 0.3 Nm |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | partially gold-plated |
| Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (2 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | green (6021) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing |
|
| Pitch | 7.62 mm |
| Width [w] | 50.75 mm |
| Height [h] | 11.83 mm |
| Length [l] | 12 mm |
| Installed height | 8.6 mm |
| Solder pin length [P] | 3.23 mm |
| Pin dimensions | 11 mm |
| PCB design | |
| Hole diameter | 1.4 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Compatible products
Your advantages
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
Well-known mounting principle allows worldwide use
Larger pitch for increased voltage requirements