SAMPLE PTSM 0,5/ 4-2,5-V-SMD
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PCB terminal block
1701086
Printed circuit board terminal, nominal current: 6 A, rated voltage (III/2): 160 V, nominal cross section: 0.5 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: PTSM 0,5/..-V-SMD, pitch: 2.5 mm, connection method: Push-in spring connection, mounting: SMD soldering, conductor/PCB connection direction: 90 °, color: black, Pin layout: Linear pad geometry, number of solder pins per potential: 1, type of packaging: packed in cardboard. SAMPLE set with 5 items in belt section. When used as part of soldering process, please use items without SAMPLE marking
Product details
| Product type | Printed circuit board terminal |
| Product family | PTSM 0,5/..-V-SMD |
| Product line | COMBICON Terminals XS |
| Number of positions | 4 |
| Pitch | 2.5 mm |
| Number of connections | 4 |
| Number of rows | 1 |
| Number of potentials | 4 |
| Pin layout | Linear pad geometry |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 32 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 160 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Connection technology | |
| Nominal cross section | 0.5 mm² |
| Conductor connection | |
| Connection method | Push-in spring connection |
| Conductor cross-section rigid | 0.14 mm² ... 0.5 mm² |
| Conductor cross-section flexible | 0.2 mm² ... 0.5 mm² (up to 0.75 mm² supported, with a stripping length of 7.5 mm and a rated insulation voltage of 32 V at III/2) |
| Conductor cross-section AWG | 26 ... 20 |
| Conductor cross-section flexible, with ferrule without plastic sleeve | 0.25 mm² ... 0.5 mm² |
| Conductor cross-section, flexible, with ferrule, with plastic sleeve | 0.25 mm² ... 0.34 mm² (possible from 0.14 mm², when using ferrule AI 0.14- 6 GY in combination with crimping pliers CRIMPFOX 10T-F) |
| Cylindrical gauge a x b / diameter | - / 1.2 mm |
| Stripping length | 6 mm |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | hot-dip tin-plated |
| Metal surface terminal point (top layer) | Tin (4 - 8 µm Sn) |
| Metal surface soldering area (top layer) | Tin (4 - 8 µm Sn) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Note on application | Pick and place pads may protrude beyond the components. The PCB layout must ensure that collisions are avoided when components are assembled. |
| Dimensional drawing |
|
| Pitch | 2.5 mm |
| Width [w] | 15.1 mm |
| Height [h] | 9 mm |
| Length [l] | 7 mm |
| PCB design | |
| Pad geometry | 1.4 x 3.4 mm |
| Pin spacing | 2.5 mm |
| Connection test | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Test for conductor damage and slackening | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60998-2-2:2002-12 |
| Conductor cross-section/conductor type/tractive force setpoint/actual value | 0.14 mm² / solid / > 10 N |
| 0.2 mm² / flexible / > 10 N | |
| 0.5 mm² / solid / > 20 N | |
| 0.75 mm² / flexible / > 30 N | |
| Flexion test | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Temperature-rise test | |
| Specification | IEC 60998-2-1:2002-12 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Insulation resistance | |
| Specification | IEC 60998-1:2002-12 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI ≥175 to <400 |
| Rated insulation voltage (III/3) | 32 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 1.3 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 160 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 1.6 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60998-1:2002-12 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Your advantages
Time saving push-in connection, tools not required
Defined contact force ensures that contact remains stable over the long term
High current carrying capacity of 6 A in very compact dimensions
Designed for integration into the SMT soldering process
Vertical connection enables multi-row arrangement on the PCB
Additional solder anchors reduce the mechanical strain on the soldering spots