ME-IO multifunctional housings

ME-IO multifunctional electronics housings with modular front connection technology

The electronics housings from the ME-IO series are particularly suitable for applications with a limited amount of installation space and high function requirements. Tailor-made modules, such as controllers and I/O modules, can be easily assembled thanks to their modular design. The Push-in connection technology and compact design enable the implementation of individual devices with up to 54 positions per overall width of 18.8 mm.

Your advantages

  • Convenient front connections for transmitting signals, data, and power, as well as optional passive heatsinks and thermal simulation for optimum heat dissipation
  • High connection density with 4- and 6-pos. connectors with 3.45 mm and 5.0 mm pitch
  • Three overall module widths of 18.8 mm, 37.6 mm, and 75.2 mm for a wide range of applications
  • Blockbelts enable connector types to be grouped mechanically in any way in a confined space
  • Bridged connectors as a TWIN connection replace TWIN ferrules
  • Additional marking option through the use of inserts in the transparent marking cover
Free sample
Test the ME-IO series multifunctional housings

Would you like to test ME-IO series electronics housings with modular front connection technology? Order your personal sample set right now. We provide expert advice on the selection and design-in of the housings in the desired application. Discover the advantages of Phoenix Contact solutions for yourself.

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ME-IO series electronics housings
Configurator for ME-IO electronics housings for controllers and I/O modules

Configurator for electronics housings for controllers and I/O modules

Complex controllers and I/O modules require high data transmission speeds. ME-IO housings in compact design enable almost 200 positions with Push-in front connection technology in one device. In addition, DIN rail connectors ensure efficient module communication. With signal indicators and operating elements like displays, it is possible to implement custom solutions.

Top innovations and applications


Heatsinks and thermal simulations for electronics housings

Heat out. Power in. Optimized cooling for ME-IO electronics housings

Maximize power density in your devices with passive cooling solutions and thermally optimized PCB layouts in ME-IO electronics housings: from configuration and comprehensive thermal simulations to implementation – ideal for powerful and miniaturized applications in control electronics.

New products

Electronics housings with thermal simulation
Connector for 8-position DIN rail connectors
Bridge for DIN rail connectors

Electronics housings with thermal simulation

Perfectly optimized for maximum power

Maximize power density in your electronics housings with passive cooling solutions and thermally optimized PCB layouts: from configuration and comprehensive thermal simulations to implementation – ideal for powerful and miniaturized applications.

Main features

  • Material: aluminum
  • Surface: natural anodized
  • Heatsink topology: extruded profile (BC) / heat spreader and extruded profile (ME-IO)
  • Maximum component height: 12 mm (BC) / 10 mm (ME-IO)
  • Heatsink width: 17.8 mm ... 53.6 mm (BC) / 8.8 mm (ME-IO)

Your Advantages

  • Efficiently embedded cooling systems through the flexible combination of heatsinks and housings for optimum cooling
  • Seamless integration with tailor-made passive solutions: optimally tuned both mechanically and thermally
  • Comprehensive service from online configuration and thermal simulations to integration
  • Minimal space requirements due to space-saving cooling for maximum power density and utilization of space

Connector for 8-position DIN rail connectors

Module communication over several levels

Some applications also require data and signals from the module communication beyond the module network, for example, in the case of a line feed. Here, input and output connectors for the 8-position DIN rail connector connect modules over several levels. They can be used on the left, right, and center.

Main features

  • 8-position module communication
  • Available as input and output
  • End bracket function

Your Advantages

  • Input and output of the 8-position bus connection in the module network with ME-IO and ICS housings
  • Optimum use of space with ordered cable routing
  • Easy marking with a large printing area

Bridge for DIN rail connectors

Making optimum use of installation space

The transmission of data and signals for applications without a necessary output to the PCB can be looped through by a bridge for DIN rail connectors below the module. This enables you to maximize the use of the PCB surface.

Main features

  • 8-position module communication
  • Available in the widths 18.8, 20, and 25 mm

Your Advantages

  • Can be integrated into device applications based on ME-IO and ICS housings
  • Increased maximum PCB surface
  • Connection of the positions in the field with FMC connectors

ME-IO series housings for I/O modules at a glance


Interactive image map: Module on a DIN rail with multifunctional housings from the ME-IO series
TBUS 8 DIN rail connector
8-pos. DIN rail connector with parallel and serial contacts for easy module-to-module communication.
TBUS 8 DIN rail connector
Optical signal displays
Light guides in various designs for status and diagnostic indicators.
Optical signal displays
Modular connection technology
Color-coded front connections for greater ease of wiring.
Modular connection technology
Different module widths and depths
Four overall module widths as well as housing versions for different PCB areas.
Different module widths and depths
Versatile display modules
Cover versions for integrating displays or touch displays that can be fully integrated.
Versatile display modules
System components that can be integrated
The ME-IO housing features connectors that can be integrated, such as RJ45 and board-to-board connectors. Passive heatsinks can also be integrated.
System components that can be integrated
Tailored cover adaptation
Customizable connection technology for devices that satisfy the latest market requirements.
Tailored cover adaptation
Heatsinks
Passive heatsinks including thermal simulation for reliable heat dissipation.
More about passive heatsinks
Heatsinks

ME-IO housing system

Tailor-made housing solution for modular control systems

Your added value in detail

Module made up of ME-IO housings
Grouped front connection technology (Blockbelts) for the ME-IO housing
Lock-and-release system on an ME-IO housing
Connection technology for the ME-IO housing with different codings
ME-IO and ICS series housings in one module on a DIN rail
Development kits
Module made up of ME-IO housings

Up to four overall module widths of 18.8 mm, 37.6 mm, 56.4 mm, and 75.2 mm enable device manufacturers to realize a wide range of applications. In addition, there are housing versions with a module depth for a PCB area up to a maximum of 6,580 mm² and up to 8,510 mm² per 18.8 mm module width. Printed circuit boards can be installed vertically and horizontally to the DIN rail.

Grouped front connection technology (Blockbelts) for the ME-IO housing

Push-in front connection technology and a compact design enable you to implement devices with up to 54 positions per overall width of 18.8 mm. This high connection density is made possible by 4- and 6-pos. connectors with 3.45 mm and 5.0 mm pitch. You can tailor the connection technology to your own design. USB, mini USB, RJ45, D-SUB, and SD cards are available for this purpose. You can use Blockbelts to mechanically group connector types in any way.

Lock-and-release system on an ME-IO housing

Lock and release connectors quickly and easily with the lock-and-release system. This allows you to replace modules without time-consuming connection work – no special tools are required.

Connection technology for the ME-IO housing with different codings

Versatile coding elements in the connector and header provide device manufacturers with increased mating reliability in connection technology.

ME-IO and ICS series housings in one module on a DIN rail

The 8-pos. TBUS 8 DIN rail connector provides up to four parallel and serial contacts for easy module-to-module communication. In addition, the TBUS 8 allows you to combine the ICS series housings with the ME-IO series housings in an application.

To the ICS series electronics housings
Development kits

Our development kits provide a quick way for you to develop your prototypes and pre-series devices. The kits contain complete housing solutions with integrated connection technology and corresponding perfboard PCBs. You can implement entire device systems with specific bus connectors. Configure your development kit in our e-shop and get started straight away on your device development project.

FAQs about optional passive heatsinks

Customer-specific heatsinks for ICS series electronics housings
Exploded view of the ICS 50 electronics housing with heatsink
Heat distribution without heatsink with the ICS DIN rail housing
Heat distribution without heatsink with the ICS DIN rail housing
Diagram of the ICS50-B122X98-V-V-7035 electronics housing
Customer-specific heatsinks for ICS series electronics housings

Heatsinks are currently available for the ICS (Industrial Case System, for the DIN rail) and UCS (Universal Case System, for outdoor use) housing series.

More about passive heatsinks
Exploded view of the ICS 50 electronics housing with heatsink

The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.

More about passive heatsinks
Heat distribution without heatsink with the ICS DIN rail housing

The maximum temperature has a particularly high impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.

More about passive heatsinks
Heat distribution without heatsink with the ICS DIN rail housing

Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.

More about passive heatsinks
Diagram of the ICS50-B122X98-V-V-7035 electronics housing

The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 mm x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.

More about passive heatsinks

Easy assembly of the ME-IO series electronics housing

The ME-IO is the housing system with the high-position front connection technology. This allows you to assemble multifunctional applications step-by-step.

E-paper
Overview of the electronics housings portfolio

Discover housings for the DIN rail and outdoor use and learn how flexibly you can adapt electronics housings to your individual needs.

Open the e-paper
DIN rail housings and field housings
Electronics housings for the DIN rail

Technical principles of electronics housings Solutions for DIN rail applications

Electronics housings are an elementary part of a device. They determine its appearance and protect the electronics from external influences. In addition, they enable assembly in superordinate units. Device manufacturers must therefore pay attention to many details, and not only in the design, but also in the choice of housing when it comes to materials and quality testing. This brochure provides you with all the details.