BC 161,6 OT U11 HS 4C 90 KMGY
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Upper housing part
1756994
DIN rail housing for use in distribution boards in accordance with DIN 43880, Upper housing part (U11) with vents, Installation depth connection technology: 11.1 mm, width: 161.6 mm, height: 89.7 mm, depth: 54.85 mm, color: light gray (similar RAL 7035)
This product needs further products for operation.
Mandatory accessories
Product details
| Assembly note | Please observe the application note in the download area. |
| Product type | Upper housing part |
| Housing type | DIN rail housing for use in distribution boards in accordance with DIN 43880 |
| Housing series | BC |
| Product family | BC 161,6.. |
| Max. number of positions | 96 (pitch: 2.5 mm) |
| 72 (pitch: 3.5 mm) | |
| 54 (pitch: 5 mm) | |
| 36 (pitch: 7.5 mm) | |
| Type | Upper housing part (U11) with vents |
| Ventilation openings present | yes |
| Dimensional drawing |
|
| Width | 161.6 mm |
| Height | 89.7 mm |
| Depth | 54.85 mm |
| Horizontal pitch | 9 Div. |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
| Color (Housing) | light gray (RAL 7035) |
| Flammability rating according to UL 94 | V0 |
| Housing material | PC |
| Surface characteristics | untreated |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60068-2-31:2008-05 |
| Height of fall | 50 cm |
| Frequency | 50 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Relative humidity (storage/transport) | 95 % |
| Number of PCB holders | 18 |
| Type of PCB mount | Latching |
| Thickness of the PCB | 1.4 mm ... 1.8 mm |
| Mounting type | Snap in |
| Type of packaging | packed in cardboard |
| Outer packaging type | Carton |
Your advantages
Coordinated housing and connection system for faster device development
Individual online configuration for diverse applications in building automation
Variety of connection technology
Can be mounted on the DIN rail or the wall
Heatsink solutions enable devices to be used in thermally demanding applications
Tailored system solution comprised of a housing, connection technology, heatsink, and additional accessories
Available in overall widths from 1 ... 9 width units (17.8 mm ... 161.6 mm)
Compliant with DIN EN 43880
Frequently asked questions
What support does Phoenix Contact provide in the area of thermal management?
Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.
How are components of different heights and sizes ideally connected to the heatsink?
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.
What influence does heating have on the reliability of a device?
The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.
Which factors influence the temperature in the housing?
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.
What information do the power dissipation diagrams provide?
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of ... View more
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.
View lessHow do heatsinks help dissipate developing heat?
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to t... View more
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to the environment. The stack effect is utilized, during which the heated air rises and is displaced by cold air.
View lessWhat other options are there for thermal optimization?
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.... View more
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.
View less