CUC-SP-J1ST-A/R4LT-THR
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RJ45 PCB connector
1337240
RJ45 PCB connector, degree of protection: IP20, number of positions: 8, 10 Gbps, material: Metal, connection method: THR reflow/THT wave
Product details
Product type | Data connector (device side) |
Type | RJ45 |
Number of positions | 8 |
Connection profile | RJ45 |
Type of packaging | Tape and Reel |
[W] tape width | 44.00 mm |
[A] coil diameter | 330.00 mm |
[W2] coil overall dimension | 49.10 mm |
Housing shield springs | No |
Number of slots | 1 |
Type | Socket |
Shielded | yes |
Insulation characteristics | |
Overvoltage category | I |
Degree of pollution | 2 |
Rated voltage (III/2) | 72 V DC |
Rated surge voltage | 1.5 kV DC |
Rated surge voltage (III/3) | 1.5 kV |
Rated surge voltage | 1 kV DC |
Rated current | 1.5 A |
Frequency range | 10 Hz ... 500 Hz |
Insulation resistance | > 500 MΩ |
Test voltage | 1 kV DC |
Test voltage Core/Core | 1 kV DC |
Test voltage Core/Shield | 1.50 kV DC |
Transmission medium | Copper |
Transmission speed | 10 Gbps |
Power transmission | PoE++ |
Connection technology | |
Connection method | THR reflow/THT wave |
Width | 16.8 mm |
Height | 16.6 mm |
Length | 15.9 mm |
Installed height | 13.70 mm |
Orientation to PCB | 90.00 ° |
Data pin length | 2.00 mm |
Material Metal surface contact area (top layer) | Au (1.27 µm/50 µ") |
Material Metal surface soldering area (top layer) | Sn (2.54 µm/100 µ") |
Material Metal surface soldering area (middle layer) | Ni (1.27 µm/50 µ") |
Material Metal surface contact area (middle layer) | Ni (1.27 µm/50 µ") |
Material | Stainless steel (Housing (shielding)) |
LCP (Housing (female/insert)) | |
Flammability rating according to UL 94 | V0 |
Housing material | Metal |
Contact material | Phosphor bronze |
Contact surface material | Gold over nickel |
Contact carrier material | LCP |
Test voltage Core/Core | 1 kV DC |
Test voltage Core/Shield | 1.50 kV DC |
Halogen-free | yes |
Mechanical data | |
Insertion/withdrawal cycles | > 750 |
Insertion force per signal contact | < 20.00 N |
Extraction force per signal contact | < 20 N |
Test specification | |
Frequency | 10-500 Hz |
Sweep speed | 1 octave/min |
Amplitude | 0.35 mm |
Acceleration | 50.00 m/s² |
Test duration | 20.00 s |
Test specification | |
Specification | IEC60068-2-27 |
Acceleration | 295.00 m/s² |
Ambient conditions | |
Degree of protection | IP20 |
Ambient temperature (operation) | -50 °C ... 85 °C |
Ambient temperature (storage/transport) | -50 °C ... 85 °C |
Mounting type | PCB mounting |
Processing notes | |
Process | THR |
Moisture Sensitive Level | MSL 1 |
Classification temperature Tc | 260 °C |
Solder cycles in the reflow | 3 |
Item number | 1337240 |
Packing unit | 120 pc |
Minimum order quantity | 120 pc |
Sales key | ***** |
Product key | ABNADA |
GTIN | 4063151639044 |
Weight per piece (including packing) | 6.61 g |
Weight per piece (excluding packing) | 6.61 g |
Customs tariff number | 85366930 |
Country of origin | CN |
ECLASS
ECLASS-13.0 | 27460201 |
ETIM
ETIM 9.0 | EC002637 |
UNSPSC
UNSPSC 21.0 | 39121400 |
EU RoHS | |
Fulfills EU RoHS substance requirements | Yes (No exemptions) |
China RoHS | |
Environment friendly use period (EFUP) |
EFUP-E
No hazardous substances above the limits
|
EU REACH SVHC | |
REACH candidate substance (CAS No.) | No substance above 0.1 wt% |
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Your advantages
The right version for every application. Available with and without LED, single- and multi-port
The reflow capability enables efficient, cost-optimized processing
High standoffs allow ideal thermal airflow during processing
Tape-on-reel packaging is perfect for automated processing
The extended temperature range from -50 °C ... +85 °C enables use in demanding applications
Through-hole technology (THT) provides high mechanical stability when connecting the female connector to the PCB
PHOENIX CONTACT (SEA) Pte Ltd
80 Bendemeer Road, #09-01A | #10-02 (Reception), Singapore 339949