PCB terminal block - SPT-THR 2,5/ 7-H-5,0 P20 R72
1135286

PCB terminal block, nominal current: 32 A, rated voltage (III/2): 400 V, nominal cross section: 4 mm2, number of potentials: 7, number of rows: 1, number of positions per row: 7, product range: SPT 2,5/..-H-THR, pitch: 5 mm, connection method: Push-in spring connection, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2 mm, number of solder pins per potential: 2, type of packaging: 72 mm wide tape


Product Details




Product line COMBICON Terminals M
Product type Printed circuit board terminal
Number of positions 7
Pitch 5 mm
Number of connections 7
Number of rows 1
Number of potentials 7
Pin layout Linear double pinning

Nominal current IN 32 A
Nominal voltage UN 400 V
Pollution degree 3
Rated voltage (III/3) 320 V
Rated surge voltage (III/3) 4 kV
Rated voltage (III/2) 400 V
Rated surge voltage (III/2) 4 kV

Connection technology
Nominal cross section 4 mm²
Conductor connection
Connection method Push-in spring connection
Conductor cross section solid 0.2 mm² ... 4 mm² (Conductor connection with open terminal point)
0.5 mm² ... 4 mm² (Push-in connection)
Conductor cross section flexible 0.2 mm² ... 4 mm²
Conductor cross section AWG 24 ... 12
Conductor cross section flexible, with ferrule without plastic sleeve 0.25 mm² ... 2.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve 0.25 mm² ... 2.5 mm²
2 conductors with the same cross section, flexible, with TWIN ferrule with plastic sleeve 0.5 mm² ... 0.5 mm²
Stripping length 10 mm

Mounting type THR soldering THR soldering
Mounting type THR soldering
Processing notes
Process Reflow/wave soldering
Moisture Sensitive Level MSL 1
Classification temperature Tc 260 °C
Solder cycles in the reflow 3

Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics hot-dip tin-plated
Metal surface terminal point (top layer) Tin (4 - 8 µm Sn)
Metal surface soldering area (top layer) Tin (4 - 8 µm Sn)
Material data - housing
Housing color black (9005)
Insulating material LCP
Insulating material group IIIa
CTI according to IEC 60112 175
Flammability rating according to UL 94 V0
Material data – actuating element
Color of the actuating lever white (9003)
Insulating material PA GF
Insulating material group I
CTI according to IEC 60112 600
Flammability rating according to UL 94 V0

Dimensional drawing
Width 35.8 mm
Height 14.8 mm
Installed height 12.8 mm
Length of the solder pin 2 mm
Length 19.15 mm
Length of the solder pin 2 mm
Hole diameter 1.2 mm
Pitch 5 mm

Test for conductor damage and slackening
Specification IEC 60999-1:1999-11
Result Test passed
Pull-out test
Specification IEC 60999-1:1999-11
Conductor cross section/conductor type/tractive force setpoint/actual value 0.2 mm² / solid / > 10 N
0.2 mm² / flexible / > 10 N
4 mm² / solid / > 60 N
4 mm² / flexible / > 60 N
0.5 mm² / solid / > 20 N

Temperature-rise test
Specification IEC 60947-7-4:2019-01
Requirement temperature-rise test The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature.
Short-time withstand current
Specification IEC 60947-7-4:2019-01
Insulation resistance
Specification IEC 60512-3-1:2002-02
Insulation resistance, neighboring positions > 5 MΩ
Air clearances and creepage distances |
Specification IEC 60947-7-4:2019-01
Insulating material group IIIa
Comparative tracking index (IEC 60112) CTI 175
Rated insulation voltage (III/3) 320 V
Rated surge voltage (III/3) 4 kV
minimum clearance value - non-homogenous field (III/3) 3 mm
minimum creepage distance (III/3) 5 mm
Rated insulation voltage (III/2) 400 V
Rated surge voltage (III/2) 4 kV
minimum clearance value - non-homogenous field (III/2) 3 mm
minimum creepage distance (III/2) 4 mm
Rated insulation voltage (II/2) 500 V
Rated surge voltage (II/2) 4 kV
minimum clearance value - non-homogenous field (II/2) 3 mm
minimum creepage distance (II/2) 5 mm

Vibration test
Specification IEC 60068-2-6:2007-12
Frequency 10 - 150 - 10 Hz
Sweep speed 1 octave/min
Amplitude 0.35 mm (10 - 60.1 Hz)
Sweep speed 50 m/s² (60.1 - 150 Hz)
Test duration per axis 2.5 h
Glow-wire test
Specification IEC 60695-2-10:2013-04
Temperature 850 °C
Time of exposure 5 s
Aging
Specification IEC 60947-7-4:2019-01
Ambient conditions
Ambient temperature (operation) -40 °C ... 105 °C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport) -40 °C ... 70 °C
Relative humidity (storage/transport) 30 % ... 70 %
Ambient temperature (assembly) -5 °C ... 100 °C

Type of packaging 72 mm wide tape
[W] tape width 72 mm
[W2] coil overall dimension 78.4 mm
[A] coil diameter 330 mm
Outer packaging type Transparent-Bag
ESD level (D) electrostatically conductive
Specification DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07

Item number 1135286
Packing unit 125 pc
Minimum order quantity 125 pc
Note Made to Order (non-returnable)
Sales Key *****
Product Key AAMCAA
GTIN 4063151068752
Weight per Piece (including packing) 2.22 g
Weight per Piece (excluding packing) 2.22 g
Customs tariff number 85369010
Country of origin PL


ECLASS

ECLASS-9.0 27440401
ECLASS-10.0.1 27440401
ECLASS-11.0 27460101

ETIM

ETIM 8.0 EC002643

UNSPSC

UNSPSC 21.0

VDE Zeichengenehmigung

Approval ID: 40046113
Approval Specification Data
Nominal Voltage UN Nominal Current IN Cross Section AWG Cross Section mm2
400 V 32 A 0.2 - 4

cULus Recognized

Approval ID: E60425-20061129
Approval Specification Data
Nominal Voltage UN Nominal Current IN Cross Section AWG Cross Section mm2
Use group B
300 V 20 A 24 - 12
Use group F
500 V 20 A 24 - 12
Use group D
300 V 10 A 24 - 12

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Your advantages

Time saving push-in connection, tools not required
Defined contact force ensures that contact remains stable over the long term
Intuitive use through colour coded actuation lever
Operation and conductor connection from one direction enable integration into front of device
Designed for integration into the SMT soldering process