Heatsink - ICE50-R100X67-A1

Heatsink, anodized, width: 67.4 mm

Product Details

General Refer to the data sheet for the range in the download area.
General Individual milling possible.
General The Rth diagram shows the application, free-hanging (vertical) in the direction of flow.

Product type Heat sink
Housing type Heatsink
Housing series ICS

Dimensional drawing
Width 67.4 mm
Height 50.1 mm
Length 105 mm
Base panel thickness [b] 5.8 mm

Color aluminum color
Material Aluminum
Surface characteristics anodized
Thermal resistance Rth 1.58 K/W (At ΔT 65 K for ambient temperature)
2.91 K/W (At ΔT 5 K for ambient temperature)

Vibration test
Specification IEC 60068-2-6:2007-12
Frequency 10 - 150 - 10 Hz
Sweep speed 1 octave/min
Amplitude 0.15 mm (10 - 58.1 Hz)
Acceleration 2g (58.1 - 150 Hz)
Test duration per axis 2.5 h
Test directions X-, Y- and Z-axis
Specification IEC 60068-2-27:2008-02
Pulse shape Semi-sinusoidal
Acceleration 15g
Shock duration 11 ms
Number of shocks per direction 3
Test directions X-, Y- and Z-axis (pos. and neg.)
Test for substances that would hinder coating with paint or varnish
Specification VDMA 24364:2018-05
Result Test passed
Ambient conditions
Ambient temperature (storage/transport) -40 °C ... 55 °C
Ambient temperature (assembly) -5 °C ... 100 °C

Mounting type Slot

Item number 1118306
Packing unit 10 pc
Minimum order quantity 10 pc
Note Made to Order (non-returnable)
Sales Key *****
Product Key ACHAEF
GTIN 4063151046705
Weight per Piece (including packing) 325.7 g
Weight per Piece (excluding packing) 249.67 g
Customs tariff number 76169990
Country of origin CN


ECLASS-9.0 27260501
ECLASS-10.0.1 27260501
ECLASS-11.0 27260501


ETIM 8.0 EC001143



China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Your advantages

Heatsinks enable the finished devices to be used in thermally demanding applications
Extensive thermal simulations help achieve the optimum arrangement of components on the printed circuit board
Customized heatsinks for reliable heat dissipation
Simplified engineering process: all the services needed for your specific device design
Tailored system solution comprised of a housing, connection technology, heatsink, and additional accessories