CUC-USB2.0-J1ST-AH/UAF-SMD
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USB PCB connectors
1332634
USB PCB connectors, degree of protection: IP20, number of positions: 4, 480 Mbps, material: Metal, connection method: Solder connection, USB 2.0
Product details
| Product type | Data connector (device side) |
| Type | USB-A |
| Sensor type | USB 2.0 |
| Number of positions | 4 |
| Connection profile | USB-A |
| Type of packaging | Tape and Reel |
| [W] tape width | 32.00 mm |
| [A] coil diameter | 330.00 mm |
| Number of slots | 1 |
| Type | Socket |
| Shielded | yes |
| Insulation characteristics | |
| Overvoltage category | I |
| Degree of pollution | 2 |
| Rated voltage (III/2) | 30 V |
| Rated surge voltage (III/2) | 1500 V |
| Rated current | 1.5 A |
| Contact resistance | 30 mΩ |
| Frequency range | 10 Hz ... 55 Hz |
| Insulation resistance | 1000 MΩ |
| Transmission medium | Copper |
| Transmission characteristics (category) | USB 2.0 |
| Transmission speed | 480 Mbps |
| Power transmission | 45 W |
| Connection technology | |
| Connection method | Solder connection |
| Width | 14.5 mm |
| Height | 7.14 mm |
| Length | 14.13 mm |
| Orientation to PCB | 90.00 ° |
| Color of the housing part | black |
| Flammability rating according to UL 94 | V0 |
| Housing material | Metal |
| Contact material | Copper alloy |
| Contact surface material | Gold over nickel |
| Contact carrier material | LCP |
| Test voltage Core/Core | 500 V |
| Test voltage Core/Shield | 500.00 V |
| Acceleration | 3.1 m/s² |
| Halogen-free | yes |
| Mechanical data | |
| Insertion/withdrawal cycles | > 1500 |
| Insertion force per signal contact | 35.00 N |
| Extraction force per signal contact | < 10 N |
| Test specification | |
| Specification | EIA 364-1000 |
| Frequency | 10-55 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Test duration | 2.00 h |
| Contact resistance R1 | 30.00 mΩ |
| Test specification | |
| Specification | 60068-2-27 |
| Acceleration | 50.00 g |
| Number of shocks per direction | 18.00 |
| Ambient conditions | |
| Degree of protection | IP20 |
| Ambient temperature (operation) | -55 °C ... 85 °C |
| Mounting type | SMD soldering |
| Processing notes | |
| Process | SMD |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Item number | 1332634 |
| Packing unit | 300 pc |
| Minimum order quantity | 300 pc |
| Sales key | 02 |
| Product key | ABNDAA |
| GTIN | 4063151628192 |
| Weight per piece (including packing) | 3.167 g |
| Weight per piece (excluding packing) | 3.167 g |
| Customs tariff number | 85366930 |
| Country of origin | CN |
ECLASS
| ECLASS-13.0 | 27460201 |
ETIM
| ETIM 9.0 | EC002637 |
UNSPSC
| UNSPSC 21.0 | 39121400 |
| EU RoHS | |
| Fulfills EU RoHS substance requirements | Yes (No exemptions) |
| China RoHS | |
| Environment friendly use period (EFUP) |
EFUP-E
No hazardous substances above the limits
|
| EU REACH SVHC | |
| REACH candidate substance (CAS No.) | No substance above 0.1 wt% |
Your advantages
Optimized for SMD reflow soldering processes
Data transmission up to 480 Mbps
Can be processed automatically thanks to tape-on-reel packaging
PHOENIX CONTACT S.A de C.V.
Lago Alberto No. 319 - Piso 9, Colonia Granada, Alcaldía Miguel Hidalgo, México, Ciudad de México, C.P. 11520