Printed circuit board terminal, nominal current: 4 A, rated voltage (III/2): 160 V, nominal cross section: 0.34 mm2, number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: PTQ 0,3/..-THR, pitch: 2.5 mm, connection method: Displacement connection, mounting: THR soldering / wave soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Zigzag pinning W, Solder pin [P]: 2 mm, number of solder pins per potential: 1, type of packaging: 32 mm wide tape. Suitable for CAT5
| Product type | Printed circuit board terminal |
| Product family | PTQ 0,3/..-THR |
| Product line | COMBICON Terminals XS |
| Type | PC termination block |
| Number of positions | 2 |
| Pitch | 2.5 mm |
| Number of connections | 2 |
| Number of rows | 1 |
| Number of potentials | 2 |
| Pin layout | Zigzag pinning W |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 4 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 200 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Data transmission | |
| Signal type | Ethernet |
| Frequency range | to 100 MHz |
| Transmission medium | Copper |
| Transmission characteristics (category) | CAT5 (IEC 11801) |
| Data transmission rate | 100 Mbps |
| Connection technology | |
| Type | PC termination block |
| Nominal cross section | 0.34 mm² |
| Conductor connection | |
| Connection method | Displacement connection |
| Conductor cross section rigid | 0.14 mm² ... 0.34 mm² |
| Conductor cross section flexible | 0.14 mm² ... 0.34 mm² |
| Conductor cross section AWG | 26 ... 22 |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Zigzag pinning W |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | hot-dip tin-plated |
| Metal surface terminal point (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface terminal point (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Note on application | The item is qualified for CAT5 Ethernet applications. For this reason, it is suited for use in IoT devices. |
| Dimensional drawing |
|
| Pitch | 2.5 mm |
| Width [w] | 7 mm |
| Height [h] | 10 mm |
| Length [l] | 17.55 mm |
| Installed height | 8 mm |
| Solder pin length [P] | 2 mm |
| Pin dimensions | 0.9 x 0.4 mm |
| PCB design | |
| Pin spacing | 2.5 mm |
| Hole diameter | 1.1 mm |
| Connection test | |
| Specification | IEC 60998-2-3:2002-12 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60999-1:1999-11 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
| 0.2 mm² / flexible / > 10 N | |
| Temperature-rise test | |
| Specification | IEC 60998-1:2002-12 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Short-time withstand current | |
| Specification | IEC 60998-2-3:2002-12 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Temperature cycles | |
| Specification | IEC 60998-2-3:2002-12 |
| Result | Test passed |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 200 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2 mm |
| Glow-wire test | |
| Specification | IEC 60998-1:2002-12 |
| Time of exposure | 5 s |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Test directions | X-, Y- and Z-axis |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 32 mm wide tape |
| [W] tape width | 32 mm |
| [W2] coil overall dimension | ≤ 38.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| Use group B | ||||
| 150 V | 2 A | 24 | ||
| Nominal voltage UN | Nominal current IN | Cross section AWG | Cross section mm2 | |
|---|---|---|---|---|
| 130 V | 4 A | - 0.2 |
