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Maximize power density in your electronics housings with passive cooling solutions and thermally optimized PCB layouts: from configuration and comprehensive thermal simulations to implementation – ideal for powerful and miniaturized applications.
Regardless of where they are used, modern power electronics are having to become more powerful yet smaller at the same time. This apparent conflict of objectives can only be effectively resolved by integrated heat dissipation, coupled with professional planning. At Phoenix Contact, you not only get high-quality electronics housings with efficiently integrated passive heatsinks, but also a unique simulation service to maximize the thermal efficiency of your individual device.
Your advantages
Efficiently embedded cooling systems through the flexible combination of heatsinks and housings for optimum cooling
Seamless integration with tailor-made passive solutions: optimally tuned both mechanically and thermally
Development-related support with personal consultation from the initial determination of power dissipation through to the final device
Minimal space requirements due to space-saving cooling for maximum power density and utilization of space
Comprehensive service from online configuration and thermal simulations to integration
Real added value with the simulation service
Through the flexible combination of aluminum heatsinks and plastic housings, our hybrid systems provide the ideal solution for the thermal optimization of your devices. The combinable design and coordinated materials enable targeted heat dissipation in various applications.
Our tailor-made passive cooling solutions for electronics housings can be optimally tuned to the mechanical and thermal requirements of your application. The components fit seamlessly into your system and ensure reliable functionality – optimized for your individual requirements.
From the initial determination of power dissipation and thermal optimization through to the final device – we support you throughout the entire development process with our expertise to ensure perfect results.
Electronics housings from Phoenix Contact with aluminum heatsinks create the right conditions for the miniaturization of your applications. This is because the more efficient the cooling, the higher the possible power density while also ensuring maximum utilization of the available installation space.
From intuitive online configuration and precise, free thermal simulations to seamless integration including the provision of M-CAD/E-CAD data – we are here to assist you every step of the way in realizing tailor-made solutions that suit your requirements.
Heat is optimally dissipated from the housing via heatsink solutions that are perfectly tailored to the housing. The heatsinks can be tailored individually to the PCB layout.
Heatsinks tailored to housings
The passive aluminum heatsinks are perfectly tailored to the geometric conditions of the housing system. They provide optimum cooling in a small amount of space.
The heatsinks can also be shaped as fillers. The cooling element does not run continuously along the printed circuit board. This leaves enough space for other components.
To carry out an initial check of the maximum power that can be dissipated from your housing application, we offer you derating diagrams tailored to the housings. You can localize the subsequent operating point and read off the maximum power dissipation accordingly. This preliminary stage of the thermal design is suitable for estimating the required housing size and provides an initial indication of the need for an integrable heatsink.
Use our intuitive online simulation tool to analyze the heat generation of your application in the early stages of development.
First, in the configurator, configure your housing to suit your application. Next, position hot spots on your PCB and define the thermal boundary conditions of your application. You will receive your application-specific results directly by email.
With our simulation service, we provide you with a very precise thermal analysis of your application based on our online simulation. Various component configurations on your printed circuit board are first simulated and evaluated. If you choose to integrate heatsinks into your device at a later date, the application will be perfectly thermally tuned via simulations to ensure that it can be used perfectly under the given boundary conditions.
Thermal management in device development is becoming an increasingly important discipline. We will be happy to advise you on the initial design of your printed circuit board, recommend thermal interface materials (TIMs), and tailor the heatsink to your components.
Your free thermal simulation for our electronics housing series
Ask us for advice on thermal simulation in your application. You are welcome to specify the initial general conditions. We will get back to you with an initial thermal assessment for implementation in one of our electronic housings – for the BC, ICS, ME-IO, or UCS series, also with integrated heatsink.
ICS series modular electronics housings for IoT applications
Compact design, high functional density, and continuous operation: IoT applications are thermally demanding and require efficient cooling. The optimized use of tailor-made heatsinks in the ICS series modular housings ensures effective heat dissipation for reliable operation. Thermal simulations during the development of PCB layouts optimize heat generation and help to avoid hot spots at an early stage.
Demanding conditions such as continuous operation and limited space are commonplace for applications in building automation. With the integration of precisely coordinated heatsinks, the BC series DIN rail housings ensure effective heat dissipation and reliable electronics in the control cabinet – right around the clock. With thermal simulations that accompany development, we help you to effectively plan the heat distribution in your devices.
ME-IO series multifunctional electronics housings for controllers
In continuous operation, control systems must meet high requirements in terms of precision and reliability. The ME-IO housing series combines high thermal efficiency with a modular design and front connection technology. Precisely coordinated heatsinks ensure effective heat dissipation, even for powerful control devices in industrial systems. Thermal simulations help to sustainably increase the service life and functionality of the controllers as early as the development stage.
Compactly embedded in larger systems with a high power density: embedded systems place significant demands on device cooling. The UCS series universal housings feature a flexible, modular design that enables optimum heat dissipation in such demanding applications. With tailored heatsinks and optimally planned thermal management thanks to thermal simulations.
Thermal simulations and tailored heatsinks for thermally demanding applications
High-performance components and demanding ambient conditions lead to high power densities in electrical devices. With our products and services, we can help you with the correct thermal design of your end application.
Solutions
Performance optimization for a wide range of applications and industries
Electronics housings with heatsinks can optimize operation in a variety of devices and applications, e.g., in HVAC systems, in energy management, and in room or building control systems. In industrial and machine control systems, they can ensure efficient heat dissipation, e.g., in continuous path control systems or programmable logic controllers (PLCs). And in e-mobility, coordinated passive cooling is also available for DC/DC converters in electric charging stations.
In factory and building automation, in data centers, in solar and wind power, and in charging infrastructure, housings and heatsinks from Phoenix Contact ensure reliable operation of high-performance components even in thermally demanding applications. They optimize operational stability and extend the service life of the devices.
FAQs
Questions and answers regarding thermal simulation
Phoenix Contact will support you with catalog values, online simulations, personal consultations including simulation services, and individually adapted heatsinks.
The component that heats up most (the hot spot) is connected to the heatsink by thermal interface material (TIM). Optional heat spreaders can additionally bridge larger distances between the component to be cooled and the heatsink.
The optimum thermal connection is implemented by individual adjustments to the heatsink. This is usually done by a milling operation on the heatsink.
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 mm x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.
The integrated heatsinks from Phoenix Contact dissipate heat from the hot spot by means of heat conduction via the thermal interface material (TIM). The heatsink releases this heat into the environment in the form of radiant energy and via convection between the fins. The stack effect is utilized, during which the heated air rises and is displaced by cold air.
Arrange a free individual consultation now
Get advice from us regarding thermal simulation for your application. You are welcome to specify the initial general conditions in your request. We will then provide you with an initial thermal evaluation for implementation in one of our electronics housings – for the BC, ICS, ME-IO, or UCS series, also with integrated heatsink.
