Main features
- For 2.5 to 3.5 mm pitch
 - Connection technologies with screw, Push-in spring, and crimp connection
 - Assembly of headers via wave or THR soldering
 - Horizontal, vertical, and inverted versions of the connectors and headers
 - Connectors for wire-to-board, board-to-board, and wire-to-wire
 - Shielded versions for optimal data transmission