ME-IO 56,4 LEB 10U TBUS 1018
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Mounting base housing
1158975
DIN rail housing, Lower housing part with metal foot catch, with vents, width: 56.88 mm, height: 120.6 mm, depth: 82.85 mm, color: yellow (similar RAL 1018), cross connection: DIN rail bus connector (optional), number of positions cross connector: 5 or 8
This product needs further products for operation.
Mandatory accessories
Product details
| Assembly note | Please observe the application note in the download area. |
| Recommendation | Material of contact pads for bus connector, galvanic gold (hard gold) |
| Product type | Lower housing part |
| Housing type | DIN rail housing |
| Housing series | ME-IO |
| Product family | ME-IO 56,4 |
| Max. number of positions | 108 (pitch: 3.45 mm) |
| 72 (pitch: 5 mm) | |
| Ventilation openings present | yes |
| Dimensional drawing |
|
| Width | 56.88 mm |
| Height | 120.6 mm |
| Depth | 82.85 mm |
| Depth from top edge of DIN rail | 76.25 mm |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
| Color (Lower housing part) | yellow (RAL 1018) |
| Material Lower housing part | PA |
| Flammability rating according to UL 94 | V0 |
| CTI according to IEC 60112 | 600 |
| Surface characteristics | untreated |
| Power dissipation single housing for 20 °C | |
| Ambient temperature | 20 °C |
| Reduction factor | 1 |
| Mounting position | vertical |
| Power dissipation | 26.8 W |
| Power dissipation single housing for 30 °C | |
| Ambient temperature | 30 °C |
| Reduction factor | 0.84 |
| Mounting position | vertical |
| Power dissipation | 22.6 W |
| Power dissipation single housing for 40 °C | |
| Ambient temperature | 40 °C |
| Reduction factor | 0.67 |
| Mounting position | vertical |
| Power dissipation | 18 W |
| Power dissipation single housing for 50 °C | |
| Ambient temperature | 50 °C |
| Reduction factor | 0.48 |
| Mounting position | vertical |
| Power dissipation | 13 W |
| Power dissipation single housing for 60 °C | |
| Ambient temperature | 60 °C |
| Reduction factor | 0.31 |
| Mounting position | vertical |
| Power dissipation | 8.3 W |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 125 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60068-2-31:2008-05 |
| Height of fall | 50 cm |
| Frequency | 50 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Test for substances that would hinder coating with paint or varnish | |
| Specification | VDMA 24364:2018-05 |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Relative humidity (storage/transport) | 80 % |
| Number of PCB holders | 3 |
| Type of PCB mount | Latching |
| Total PCB surface | 22700 mm² |
| Thickness of the PCB | 1.4 mm ... 1.8 mm |
| Mounting type | DIN rail mounting |
| Type of packaging | packed in cardboard |
| Outer packaging type | Carton |
Your advantages
Easy, tool-free mounting
Optional DIN rail connector for easy module-to-module communication
Lock and Release principle for automatic latching and intuitive release of the front connection plug
Plastic in accordance with UL94 V0: for more rigorous flammability requirements
Versatile use: deeper design for more PCB space
Greater flexibility: combination with ICS series electronics housing using DIN rail connectors
L-design: ideal for flush integration of standard interfaces such as RJ45