PCB terminal blocks enable the easy and safe transmission of signals, data, and power to the PCB. They are suitable for a variety of applications in numerous industries, markets, and for Industry 4.0 applications. Our COMBICON range for the XS to XXL product lines includes metric and imperial pitches ranging from miniature terminal blocks with 2.5 mm pitch to power-level terminals with 20 mm pitch.
More informationWe provide the right PCB terminal block for your application. Benefit from the unique breadth of our portfolio:
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PCB terminal blocks for simple connection on the PCB
Generate your desired PCB terminal block versions. When doing so, use our extended portfolio and choose your desired product with your preferred color, printing, and coding.
Shield connections matched to the PCB terminal blocks and connectors for data transmission enable reliable grounding of the cable shield, thus contributing to EMC protection. Choose the optimal shield connection for your application from multiple versions.
Main features
Main features
Main features
Main features
Main features
Main features
TWIN design PCB terminal blocks of the same shape feature identical sizes and pinning, and are suitable for the flexible requirements and device designs of Industry 4.0. Whether with screw connection or spring connection, the terminal blocks have the right connection technology for device design in the Internet of Things.
The low installed height of the SPTAF 1 PCB terminal block is ideal for building technology and flat modules. A 45 degree cable connection funnel and various push button variants enable quick and easy installation. Push-in Technology enables the practical and reliable connection of rigid and flexible conductors up to AWG 16 to the PCB.
The product range features a variety of connection options. From established screw connection, through IDC fast connection, right through to innovative Push-in Technology. These fundamental connection methods are available for your applications.
The screw connection is maintenance-free and, with the multi-conductor connection, enables a high level of flexibility and a high load-carrying capacity. Connections with a wire guard are particularly well-suited for semi-industrial applications in building automation, safety technology, and telecommunications. With connections via tension sleeve, you can ideally connect industrial applications with high demands on contact reliability. The front screw connection is suitable for narrow device fronts and PCB racks.
In the field of spring connections, Phoenix Contact offers you connection technologies with Push-in spring connection, lever Push-in connection, spring-cage connection, SUNXCLIX spring connection, and the T-LOX knee-lever connection. The easy operation of this connection method saves device manufacturers time during installation. The connections are also vibration-free due to the spring contact elements.
The IDC insulation displacement connection is a particularly time-saving connection technology that does not require conductor pretreatment. With this connection method, the cutting metal cuts through the insulation and establishes a reliable connection to the conductor.
PCB terminal blocks can be mounted on the PCB through a variety of methods. These methods include wave soldering, THR soldering (Through Hole Reflow), and SMT soldering (Surface Mount Technology). This means that you can assemble PCBs efficiently and process them reliably.
Wave soldering is the classic soldering process for manufacturing electronic modules that are predominantly assembled with through-hole components. The soldering contact inserted through the PCB and the soldering on the bottom of the PCB are characteristic of this soldering process.
Surface mount technology (SMT) is used for surface mounting components. The components are assembled on the PCB surface in solder paste and soldered using the reflow soldering process. This method requires special components with corresponding surface contacts.
Through-hole reflow soldering (THR) enables the integration of through-hole components made from high-temperature material into the SMT reflow process. During this process, the through-hole contacts are inserted into the holes filled with soldering paste and soldered using the reflow soldering process.