ICS modular electronics housings

ICS modular electronics housings for IoT applications

The solutions made possible by the ICS modular housing system are as varied as the requirements for future-oriented automation devices. Benefit from a housing system with graduated sizes, variable connection technology, and optional DIN rail connectors.

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Go to Product Detail Page for item 1380485
ICC20-TS2,5/3L5,0-7035 - PCB terminal block
ICC20-TS2,5/3L5,0-7035 - PCB terminal block
1380485

PCB terminal block, nominal current: 24 A, rated voltage (III/2): 300 V, nominal cross section: 2.5 mm2, number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: ICC..-TS2,5/..L5,0, pitch: 5 mm, connection method: Screw connection with tension sleeve, screw head form: H1L Slotted Phillips recess, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: light gray, Pin layout: Linear pinning, number of solder pins per potential: 1, type of packaging: packed in cardboard. Product with pin output on left side

NEW
Go to Product Detail Page for item 1474499
ICC25-TP1,5/5R3,5-7035 - PCB terminal block
ICC25-TP1,5/5R3,5-7035 - PCB terminal block
1474499

PCB terminal block, nominal current: 8 A, rated voltage (III/2): 150 V, nominal cross section: 1.5 mm2, number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: ICC..-TP1,5/..R3,5, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: light gray, Pin layout: Linear pinning, Solder pin [P]: 2.8 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard. Product with pin output on right side

NEW
Go to Product Detail Page for item 1474477
ICC20-TP2,5/3R5,0-7035 - PCB terminal block
ICC20-TP2,5/3R5,0-7035 - PCB terminal block
1474477

PCB terminal block, nominal current: 18 A, rated voltage (III/2): 300 V, nominal cross section: 2.5 mm2, number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: ICC..-TP2,5/..R5,0, pitch: 5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: light gray, Pin layout: Linear pinning, Solder pin [P]: 3.15 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard. Product with pin output on right side

NEW
Go to Product Detail Page for item 1380298
ICC25-TS1,5/5R3,5-7035 - PCB terminal block
ICC25-TS1,5/5R3,5-7035 - PCB terminal block
1380298

PCB terminal block, nominal current: 16 A, rated voltage (III/2): 150 V, nominal cross section: 1.5 mm2, number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: ICC..-TS1,5/..R3,5, pitch: 3.5 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: light gray, Pin layout: Linear pinning, number of solder pins per potential: 1, type of packaging: packed in cardboard. Product with pin output on right side

NEW
Go to Product Detail Page for item 1380292
ICC20-TS1,5/4R3,5-7035 - PCB terminal block
ICC20-TS1,5/4R3,5-7035 - PCB terminal block
1380292

PCB terminal block, nominal current: 16 A, rated voltage (III/2): 150 V, nominal cross section: 1.5 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: ICC..-TS1,5/..R3,5, pitch: 3.5 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: light gray, Pin layout: Linear pinning, number of solder pins per potential: 1, type of packaging: packed in cardboard. Product with pin output on right side

Your advantages

  • Flexible use with the modular system and unique modularity in the connection technology
  • Standardized connections such as RJ45, USB, D-SUB, and antenna sockets as integrative components
  • Optimal space utilization and adaptability of design, colors, and printing
  • 8-pos. DIN rail connectors with parallel and serial contacts for easy module-to-module communication
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Test the ICS series modular housings
Would you like to test ICS series electronics housings for IoT applications? – Order your personal sample set right now. We provide expert advice on the selection and design-in of the housings in the desired application. Discover the advantages of Phoenix Contact solutions for yourself.
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ICS series electronics housings
Field housings and DIN rail housings

Configurator for electronics housings

Create your electronics housing for the field or indoor application: Select the desired housing series, the corresponding lower part, and the cover. Add the appropriate connection technology and the process is complete.

Housing covers for the ICS series DIN rail housings

Tailored in design and color: Housing covers for the ICS series DIN rail housings

Configurator for individual ICS-series housing covers

Design your own individual ICS series housing covers. Use the PROTIQ 3D-printing service for prototype production. Once you have decided upon a design, you can move on to the series production of your individual housing cover.

New products

Connector for 8-position DIN rail connectors
Bridge for DIN rail connectors
PCB terminal blocks in two pitches for the ICS series

Connector for 8-position DIN rail connectors

Module communication over several levels

Some applications also require data and signals from the module communication beyond the module network, for example, in the case of a line feed. Here, input and output connectors for the 8-position DIN rail connector connect modules over several levels. They can be used on the left, right, and center.

Main features

  • 8-position module communication
  • Available as input and output
  • End bracket function

Your Advantages

  • Input and output of the 8-position bus connection in the module network with ME-IO and ICS housings
  • Optimum use of space with ordered cable routing
  • Easy marking with a large printing area

Bridge for DIN rail connectors

Making optimum use of installation space

The transmission of data and signals for applications without a necessary output to the PCB can be looped through by a bridge for DIN rail connectors below the module. This enables you to maximize the use of the PCB surface.

Main features

  • 8-position module communication
  • Available in the widths 18.8, 20, and 25 mm

Your Advantages

  • Can be integrated into device applications based on ME-IO and ICS housings
  • Increased maximum PCB surface
  • Connection of the positions in the field with FMC connectors

PCB terminal blocks in two pitches

For ICS series electronics housings

New PCB terminal blocks in two pitches extend the connection variety for ICS series electronics housings. Choose between screw or Push-in connection versions of the new terminal blocks for your device solution.

Main features

  • For ICS overall widths of 20, 25, and 50 mm
  • Push-in spring connection and screw connection
  • Pitch: 5.75 mm
  • Alignment left and right

Your Advantages

  • Simple handling in just a few steps
  • Fixed wiring and a reduced number of individual parts
  • Choice between different pitches and connection methods
  • One partner for everything: the right components for your device solution

ICS series housings for IoT applications at a glance

Benefit from a comprehensive selection of modules and high level of flexibility in connection technology. The modular DIN rail housings of the ICS series also feature a large portfolio of suitable accessories such as displays, membrane keypads, and board-to-board connectors. Click on one of the spots for more information about the housing system.

Modular ICS electronics housings for IoT devices in Industry 4.0 applications
DIN rail connectors
8-pos. DIN rail connectors with parallel and serial contacts for easy module-to-module communication.
DIN rail connectors
Fiber-optic cables
Fiber-optic cables for a reliable status indicator.
Fiber-optic cables
Heatsinks
Heatsinks for reliable heat dissipation.
More about individual heatsinks
Heatsinks
Display modules and membrane keypads
Display integration for user-friendly operation.
Display modules and membrane keypads
Connection technology
Connection technology that can be positioned as desired.
Connection technology
Tailored front cover
Tailored design of a distinctive cover.
To the individual enclosure covers of the ICS series
Tailored front cover

The basis for IoT devices of tomorrow: ICS series electronics housings

ICS-series modular electronics housings for IoT applications
ICS-series modular electronics housings for IoT applications YouTube
ICS plastic housing in ice cube

Passive heatsinks and thermal simulations for demanding applications

Miniaturization leads to an increasingly high packing density in the electronics, which in turn requires efficient cooling. Individual heatsinks provide the necessary heat dissipation. These allow the modules ICS series housings to be used in thermally demanding applications. Use thermal simulations as an aid in designing the PCB layout.

Individual heatsinks for ICS series electronics housings
Individual heatsinks for ICS series electronics housings YouTube

Individual heatsinks for ICS series electronics housings

Passive heatsinks enable the finished devices to be used even in thermally demanding applications. Extensive thermal simulations help achieve the optimum arrangement of components on the printed circuit board.

FAQs about optional passive heatsinks

Customer-specific heatsinks for ICS series electronics housings
Exploded view of the ICS 50 electronics housing with heatsink
Heat distribution without heatsink with the ICS DIN rail housing
Heat distribution without heatsink with the ICS DIN rail housing
Diagram of the ICS50-B122X98-V-V-7035 electronics housing
Customer-specific heatsinks for ICS series electronics housings

Heatsinks are currently available for the ICS (Industrial Case System, for the DIN rail) and UCS (Universal Case System, for outdoor use) housing series.

More about passive heatsinks
Exploded view of the ICS 50 electronics housing with heatsink

The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.

More about passive heatsinks
Heat distribution without heatsink with the ICS DIN rail housing

The maximum temperature has a particularly high impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.

More about passive heatsinks
Heat distribution without heatsink with the ICS DIN rail housing

Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.

More about passive heatsinks
Diagram of the ICS50-B122X98-V-V-7035 electronics housing

The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 mm x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.

More about passive heatsinks

Modular housings with variable connection technology

8-position DIN rail connector
Modular connection technology for ICS housings
The ICS housing in different overall widths, installed heights, and installed depths
The ICS housing with high packing densities
Display modules and membrane keypads for the ICS housing
Light guides in a variety of designs
8-position DIN rail connector

Connect individual ICS housings together easily. 8-position TBUS 8 DIN rail connectors with serial and parallel contacts enable easy module-to-module communication in the control cabinet.

Modular connection technology for ICS housings

The ICS series for the DIN rail features modular connection technology for RJ45, D-SUB, USB, and antenna connections that is unique on the market. PCB headers enable plug-in connection technology of the ICS housing series. Connectors with screw or Push-in technology, with 3 and 4 positions with 5.0 mm pitch increase their flexibility.

The ICS housing in different overall widths, installed heights, and installed depths

The modular system of the ICS housing provides a high level of scalability, tailor-made for your requirements. Overall widths of 20 mm, 25 mm, and 50 mm, installed heights of 77.5 mm, 100 mm, and 122.5 mm, and installed depths of 87.5 mm, 110 mm, and 132.5 mm are available.

The ICS housing with high packing densities

Because of its flexibility, the ICS housing enables technically complex solutions to be implemented in a confined space in the control cabinet. Make ideal use of the space for up to two PCBs with a width of 25 mm and for up to four PCBs with a width 50 mm – with an installation time of just a few seconds. This gives you more space and area for relays and electrolytic capacitors. The design, colors, and printing can be tailored.

Display modules and membrane keypads for the ICS housing

The visualization and adjustment of processes and characteristic values at the touch of a finger are becoming increasingly important. Touch displays and high-resolution displays with membrane keypads enrich the equipment of the ICS series modular system.

Light guides in a variety of designs

Light guides are available in various designs for status and diagnostic indicators. Mounting is simple thanks to press pins. On request, the fiber-optic cables can be supplied matched to your DIN rail housing.

3D View

360° view of displays and keypads for ICS electronics housings

2.4" touch displays and 0.96" displays with configurable membrane keypads round out the ICS series electronics housings portfolio.

Discover the high level of operating convenience offered by the ICS housings in the adjacent 3D view.

Mounting device for ICS series housings
Mounting device for ICS series housings YouTube

Mounting device for ICS series electronics housings

The range of accessories for the ICS housing series now includes a user-friendly mounting device. The mounting device can be used with ICS housings of various sizes.

Two hands with soil, a plant, and a Phoenix Contact product

Bio-based products

Phoenix Contact develops technologies and solutions for a better future. Climate protection and environmental emissions such as carbon dioxide are central starting points of our sustainability strategy. For example, we are switching an initial range of products over to bio-based plastics.

ME-IO series electronics housings

Can be combined with ME-IO series housings

Use the strengths of two housing families for your application: The two product families ME-IO and ICS can be combined flexibly with each other via T-BUS DIN rail connectors – in whichever way your application requires.

E-paper
Overview of the electronics housings portfolio
Discover housings for the DIN rail and outdoor use and learn how flexibly you can adapt electronics housings to your individual needs.
Open the e-paper
DIN rail housings and field housings
Electronics housings of the ME MAX series

Technical principles of electronics housings Solutions for DIN rail applications

Electronics housings are an elementary part of a device. They determine its appearance and protect the electronics from external influences. In addition, they enable assembly in superordinate units. Device manufacturers must therefore pay attention to many details, and not only in the design, but also in the choice of housing when it comes to materials and quality testing. This brochure provides you with all the details.

Ideally suited for these industries

In addition to being used for various applications, the ICS housing is suitable for these industries, among others: