Efficient housing with front connection technology for controllers and I/O modules.

ME-IO Slim compact electronics housing for controllers and I/O modules

For controllers that require a compact design and high-density front connection technology, the ME-IO Slim multifunctional housings are a simple and efficient solution. The 18-pos. front connector makes contact directly on the PCB. The module width of the I/O housings is 12 mm. In addition, housings are available for couplers and CPU modules.

NEW
Go to Product Detail Page for item 1633999
HSCH-S 1,5-6 POWER-9005 - PCB header
HSCH-S 1,5-6 POWER-9005 - PCB header
1633999

PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 300 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 2, number of positions: 6, number of connections: 6, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, number of solder pins per potential: 1, plug-in system: HSCH-S 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard

NEW
Go to Product Detail Page for item 1634000
HSCP-SP 1,5-6 POWER-9005 - PCB connector
HSCP-SP 1,5-6 POWER-9005 - PCB connector
1634000

PCB connector, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Socket, number of potentials: 6, number of rows: 2, number of positions: 6, number of connections: 6, pitch: 5.08 mm, connection method: Push-in spring connection, conductor/PCB connection direction: 0 °, locking clip: - Locking clip, plug-in system: HSC 1,5, locking: without, mounting method: without, type of packaging: packed in cardboard

NEW
Go to Product Detail Page for item 1569965
HSCP-SP 1,5-18-IO-7035 - PCB connector
HSCP-SP 1,5-18-IO-7035 - PCB connector
1569965

PCB direct plug, nominal cross section: 1.5 mm2, color: light gray, nominal current: 5 A, rated voltage (III/2): 63 V, number of potentials: 18, number of rows: 2, number of positions: 18, number of connections: 18, pitch: 5 mm, connection method: Push-in spring connection, mounting: Direct plug-in method, conductor/PCB connection direction: 0 °, locking: Snap-in locking, type of packaging: packed in cardboard

Your advantages

  • Simple module assembly with two side panels and one DIN rail locking lever
  • High connection density with 18-pos. connector with a 5 mm pitch
  • Ideal for price-sensitive applications due to the simple design and predefined module design
  • Machinable flaps in the CPU module allow application-specific customization
  • Preprinted 18-pole front connector makes cabling in the module easy

Main features at a glance

We offer you the right ME-IO Slim housing for your application. Benefit from the unique range of our portfolio.

ME-IO Slim series multifunctional housings

Number of positions (IO) 18
Module width 12 mm
Further housings Coupler, CPU
Colors Light gray (similar to RAL 7035)
Plastic Polycarbonate
Number of positions (bus) 8
Number of positions (supply) 6
Status indicator LED

Detailed product presentation

ME-IO Slim series electronics housings
DIN rail connection
The I/O modules can be pushed vertically onto the DIN rail and aligned with the other modules in a row.
DIN rail connection
Status indicator
The 18x LED display makes it possible to indicate the status of the individual modules.
Status indicator
18-pos. front connector
The swiveling front connector with up to 5 A makes contact directly on the PCB.
18-pos. front connector
6-pole supply connector
The 6-pos. connector supplies the controller with a maximum amperage of 8 A.
6-pole supply connector
Further connection technology
The coupler and CPU module can integrate two to three RJ45 sockets and one USB-C socket for further connections.
Further connection technology
Module communication
Module communication module via 8-pos. bus with up to 4 A.
Module communication

Efficient housing system with front connection technology

Simple setup
Optional FE contact
Tool-free mounting on the DIN rail
Preprinted connectors
Customized connection technology in the CPU module
Simple setup

After you select the head station, you can put the IO modules together easily in any order. The modules consist of two side plates with the PCB inserted in between. The front connector is swiveled directly onto the PCB.

Optional FE contact

An optional FE contact can be integrated into each module. It is in the ideal position for establishing an optimal connection to the DIN rail. This ensures reliable and efficient contacting.

Tool-free mounting on the DIN rail

The modules can be easily pushed vertically onto the DIN rail. A simple yet effective latching mechanism connects the modules securely and stably. To release a module, simply use a screwdriver to unlock the orange latches and gently pull the module out.

Preprinted connectors

The connectors are preprinted, which makes it easy to identify the positions. The Push-in connection technology makes installation extremely easy and user-friendly. In addition, holes for the test pick-off ensure safe commissioning.

Customized connection technology in the CPU module

If the RJ45 and USB connections do not meet the requirements of your application, machinable flaps allow you to integrate additional connection technology. This allows you to react flexibly and easily to the specific requirements of your application.

E-paper
Overview of the electronics housings portfolio

Discover housings for the DIN rail and outdoor use and learn how flexibly you can adapt electronics housings to your individual needs.

Open the e-paper
DIN rail housings and field housings
Electronics housings for the DIN rail

Technical principles of electronics housings Solutions for DIN rail applications

Electronics housings are an elementary part of a device. They determine its appearance and protect the electronics from external influences. In addition, they enable assembly in superordinate units. Device manufacturers must therefore pay attention to many details, and not only in the design, but also in the choice of housing when it comes to materials and quality testing. This brochure provides you with all the details.