ME-IO 37,6 LB PROCESSED
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Mounting base housing
1726227
DIN rail housing, Lower housing part, with vents, width: 37.89 mm, height: 120.6 mm, depth: 64.3 mm, color: light gray (similar RAL 7035), cross connection: DIN rail bus connector (optional), number of positions cross connector: 5 or 8
This product needs further products for operation.
Mandatory accessories
Product details
| Recommendation | Further information and detailed dimensions are available in the download area. |
| Recommendation | Material of contact pads for bus connector, galvanic gold (hard gold) |
| General | Cutout for heatsink available |
| Assembly note | Please observe the application note in the download area. |
| Product type | Enclosure bottom part |
| Housing type | DIN rail housing |
| Housing series | ME-IO |
| Product family | ME-IO 37,6 |
| Max. number of positions | 60 (pitch: 3.45 mm) |
| 40 (pitch: 5 mm) | |
| Type | Lower housing part |
| Ventilation openings present | yes |
| Dimensional drawing |
|
| Width | 37.89 mm |
| Height | 120.6 mm |
| Depth | 64.3 mm |
| Depth from top edge of DIN rail | 57.7 mm |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
| Color (Housing) | light gray (RAL 7035) |
| Flammability rating according to UL 94 | V0 |
| CTI according to IEC 60112 | 600 |
| Housing material | PA |
| Surface characteristics | untreated |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 125 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60068-2-31:2008-05 |
| Height of fall | 50 cm |
| Frequency | 50 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Test for substances that would hinder coating with paint or varnish | |
| Specification | VDMA 24364:2018-05 |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Relative humidity (storage/transport) | 80 % |
| Number of PCB holders | 2 |
| Type of PCB mount | Latching |
| Total PCB surface | 10300 mm² |
| Thickness of the PCB | 1.4 mm ... 1.8 mm |
| Mounting type | DIN rail mounting |
| Type of packaging | Box packaging |
Your advantages
Easy, tool-free mounting
Optional DIN rail connector for easy module-to-module communication
Lock and Release principle for automatic latching and intuitive release of the front connection plug
Plastic in accordance with UL94 V0: for more rigorous flammability requirements
L-design: ideal for flush integration of standard interfaces such as RJ45
Greater flexibility: combination with ICS series electronics housing using DIN rail connectors
Frequently asked questions
What support does Phoenix Contact provide in the area of thermal management?
Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.
How are components of different heights and sizes ideally connected to the heatsink?
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.... View more
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.
View lessWhat influence does heating have on the reliability of a device?
The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.... View more
The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.
View lessWhich factors influence the temperature in the housing?
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.... View more
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.
View lessWhat information do the power dissipation diagrams provide?
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of ... View more
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.
View lessHow do heatsinks help dissipate developing heat?
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to t... View more
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to the environment. The stack effect is utilized, during which the heated air rises and is displaced by cold air.
View lessWhat other options are there for thermal optimization?
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.... View more
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.
View less